MDEP 3225(4#) Low CTE Epoxy potting compound

Excellent bond and cracking resistance
Low CTE linear expansion coefficient
High thermal conductivity
Excellent electrical insulation and stability
It is used in the temperature range of -50℃-180℃
Water absorption is very low, good water and moisture resistance
Excellent adhesion to metals (iron, aluminum and copper)

Product description

MDEP 3225(4#) A/B is a two-component solvent-free room temperature curing epoxy potting-sealing material, suitable for motors, automotive electronics, power tools, reactors, instruments have high thermal conductivity requirements of the product packaging protection, and has excellent adhesion and insulation properties.

Data Sheet

Test items	Test Standard	Units	Part A	Part B
Colour	Visual	—	White or black paste	Colorless or light yellow clear liquid
Viscosity	GB/T 2794-2013	25 ° C, mPa·s	135000 + 35000	100 + 20
Density	GB/T 13354-1992	25 ° C, g/cm3	1.83 + / – 0.05	0.96 + / – 0.05
Mixing ratio	Mass ratio	Ratio=A:B	100:7
Mixing viscosity	GB/T 10247-2008	160g, mPa·s	23,000±5,000 at 25 ° C 40 ° C, 10,000± 2,000 At 60 ° C, 5,000± 1,000 80 ° C, 1,000± 300
Operating time	GB/T 10247-2008	A+B=160g, min	25 ° C, 50±15 mins 40 ° C, 30 mins 60℃, 15 mins 80 ° C, 10 mins
Gel time	GB/T 10247-2008	25 ° C, hr	4-5 hr
Hardness	GB/T 531-2008	Shore D	25 ° C, 90±5
			130 ° C, 80
			150 ° C, 76
Thermal conductivity	GB/T 10297-1998	W/mK	0.7
Glass transition temperature	GB/T 22567-2008	℃	120
Coefficient of expansion	GB/T 20673-2006	μm/ (m, ° C)	<Tg, 25 >Tg, 65
Impact strength	GB/T 1843-2008	KJ/m2	15
Shear strength	GB/T 7124-2008	Mpa, iron-iron Mpa, copper-copper	13 or higher 11
Cure shrinkage rate	HG/T 2625-1994	%	0.83
Dielectric strength	GB/T 1693-2007	kV/mm (25 ° C)	≥18
Loss factor	GB/T 1693-2007	(1MHz) (25 ° C)	0.005
Dielectric constant	GB/T 1693-2007	(1MHz) (25℃)	2.8
Volume resistance	GB/T 1692-92	DC500V,Ω· cm	1.0E +15

Application

Suitable for motors, automotive electronics, power tools, reactors, instruments have high thermal conductivity requirements of the product packaging protection, and has excellent adhesion and insulation properties.

How to use

Operation process

Glue: Because the filler contained in component A will precipitate with the time of placement, so before use, the A component is stirred evenly in the original package, and then the A and B components are weighed according to the weight ratio of 100:7, and can be potting after mixing evenly.
Component B in the storage process may appear crystallization or agglomeration (belongs to the normal situation), if the crystallization needs to be placed in the 80℃ oven to melt it before use, and then cold to room temperature after use, this will not affect its performance.
Exposed in the air, component B will react with moisture to produce hydrolysis, and the hydrolysis product is a white powdery substance. Try to avoid pouring white material when weighing.
When AB material is mixed, many bubbles will be included in the mixing, and vacuum defoaming is required, which is conducive to increasing the electrical performance of the device.
Material A viscosity is high, can be pre-baked at 40℃, and then take out and B material according to the weight ratio of 100:7 mixed.
Initial curing condition: Tg100℃ can be obtained at 25℃*24 hours. To obtain higher temperature resistance and stronger toughness, please warm up 130 degrees after curing at room temperature for 1 hour; Or design the curing process according to 80℃*2 hours +130℃*1 hour after potting.
Customers can adjust the curing temperature and time according to the actual size of the potting object, the size is about small, and the curing time can be short.
If you need to use glue filling equipment, please consult our Marketing Department.
To use the equipment for filling sealing, it is necessary to heat the A\B cylinder separately to reduce the viscosity. The decrease in the viscosity of the mixed adhesive material will improve the permeability in the glue filling object.
The amount of curing agent B component more or less than the normal ratio will reduce the hardness of the product at high temperature.
The greater the difference in the amount of curing agent B component, the greater the change in the hardness of the colloid, and the worse the temperature resistance.