MDTIM 5525 2.5w Silicone liquid thermal coductivity Gap Filler

  • 1:1 mixing (thixotropic)
  • Low stress application
  • Easy to operate
  • Heating acceleration reaction
  • Low hardness and micro-stick
  • Platinum catalyzed and the siloxane volatiles are extremely low
  • ROHS, halogen free, REACH certified
  • UL No.:E538545

MDTIM 5525 Silicone Gap Filler, thixotropic low stress applications, designed to provide enhanced thermal management for advanced automotive batteries, automotive electronics, and communications equipment. Compared with traditional materials, it provides enhanced reliability and rework ability. Liquid Thermal Conductivity Gap Filler is a highly adaptable material that is easy to use, eliminates assembly tolerances, makes the components on production almost low compression, protects solder joints and Other components. The liquid thermal gel gasket can be perfectly reworked and repaired, significantly reducing the overall cost. The automatically controlled feeding can significantly reduce waste and reduce the overall cost again. It is a two-component fast curing liquid thermal gel gasket. Fully automated assembly is possible, corresponding to the thermal interface materials of Industry 4.0.

MDTIM 5525 METHOD UNIT
Color Part A White paste Visual
Color Part B Blue paste Visual
Density, A 2.90-3.30 GB/T 13354-1992 g/ml
Density, B 2.90-3.30 GB/T 13354-1992 g/ml
A:B 100 : 100
Mix viscosity 330 ASTM D2196 Pa.s
Shelf life@ 25℃ 9 month month
After-curing performance
Color Blue Visual
Working Time ≥30 25℃ mins
Tack free time 90 25℃ mins
Curing condition 5-6hrs/25℃ or 30mins /80℃ or 5mins/100℃
Hardness 60-70 GB/T 531.1-2008 Shore 00
Tensile strength 0.3 ASTMD412 Mpa
Elongation 150 ASTMD412 %
Operating temperature -60~200
Electrical performance
Breakdown voltage 20 ASTM D149 KV/mm
Volume resistance 1*1014 ASTM D257 Ohm-cm
Dielectric constant 4.8 ASTM D150 (1KHz)
Flammability rating V-0 UL94 1.5mm
Thermal Conductivity ≥2.5 GB/T 10297-2015 W/m*K
Specific heat capacity 1 ASTM E1269 J/g-K
Maximum particle size 90 μm
  • Lithium battery
  • vehicle electronics
  • Communication facility
  • Computer and peripheral products
  • Application between heat source and heat sink

Instructions for use

Mixing:

  • Mixing part A and part B according to weight or volume ratio 1:1.
  • The Dual Cartridge package should be mixed with a matching glue gun or automatic gauge to avoid bubble formation.
  • Manual mixing is not recommended.

Use:

— 50ml or 400ml Dual Cartridge

  • Install the Dual Cartridge into the applicator and remove the end cap from the front of the Dual Cartridge.
  • After installing the Dual Cartridge, squeeze the mix from the nozzle until the A and B components are evenly mixed.
  • The mixed glue is applied to the substrate and mated with the part.
  • During the working time of the gap filler, clamp the positioning to achieve the treatment strength or gap thickness

–Dispensing equipment

  • Ifyou need Dispensing equipment, please consult the sales department or the nearest salesperson

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