MDEP 3115(2#) High Thermal conductivity Epoxy potting compound

Excellent adhesion, cracking resistance
Low CTE linear expansion coefficient
High Thermal conductivity Epoxy potting compound 1.5W/M.K.
Excellent electrical insulation and stability
It is used in the temperature range of -50℃-200℃
Water absorption is very low, good water and moisture resistance

MDEP 3115(2#)A/B is a two-component solvent-free environmental curing 1,5W high Thermal conductivity Epoxy potting compound that can also be cured by temperature.

Data Sheet

Test items	Test criteria	Units	MDEP 3115(2#) A	MDEP 3115(2#) B
Color	Eye test	—	Black liquid	Light yellow liquid
Viscosity	GB/T 2794-2022	25℃，mPa·s	40,000±8,000	40±20
Density	GB/T 13354-1992	25℃，g/cm3	2.6±0.1	0.95±0.05
Mixing ratio	Mass ratio	Ratio=A:B	100：5
Mixing viscosity	GB/T 2794-2022	25℃，mPa·s	6,000±1,500
Operating time	GB/T 2794-2022	25℃ , min	80±15
Hardness	GB/T 531.1-2008	Shore D，25℃	90±5
Thermal conductivity	GB/T 10297-1998	W/mK	1.5
Coefficient of expansion	GB/T 20673-2006	μm/（m，℃）	25， < Tg 62， > Tg
Glass transition temperature	GB/T 22567-2008	℃	95, 80℃* 3h; 105, 120℃* 2h; 105, curing 120°C 2hr;
Shear strength	GB/T 7124-2008	Mpa，Fe/Fe AI/AI	≥10 ≥8
Dielectric strength	GB/T 1843-2008	kV/mm（25℃）	≥18
Dielectric loss	GB/T 1693-2007	（1MHz）(25℃)	0.09
Dielectric constant	GB/T 1693-2007	（1MHz）(25℃)	3.1
Volume resistance	GB/T 1693-2007	DC500V,Ω·cm	1.00E +15
Service temperature	GBT 20028-2005	℃	-50-200

It is suitable for the packaging and protection of motors, automotive electronics, power tools, reactors, meters and other products with high thermal conductivity requirements, and has excellent adhesion and temperature resistance.

How to use

Operation process

Glue: Because the filler contained in component A will precipitate with the passage of time, before use, after stirring component A in the original package, weigh component A and component B according to the weight ratio of 100:5, and then potting can be performed after mixing evenly.
Component B is exposed to the air and hydrolyzed by reaction with water, and the hydrolyzed product is a white powdery substance. Try to avoid pouring white material when weighing.
If necessary, you can continue to vacuum the potting device, which is conducive to improving the electrical performance of the device.
Curing conditions :25°C*24 hours. For best performance, follow a curing process of 10°C*2 hours or 80°C*3 hours.
If you need to use glue filling equipment, please consult our Marketing Department.