MDEP 322 Black epoxy structure adhesive

One components epoxy adhesive
Black epoxy structure adhesive
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts

Product description

MDEP 322 is a black solvent-free one-component epoxy adhesive with low viscosity, good fluidity, good operability, good toughness, high and low temperature resistance, adhesion and low curing shrinkage.

Data Sheet

Item	Test method or condition	Test results
Item	Test method or condition	MDEP 322
Before the curing
Appearance	Visual	Black slurry
Viscosity	cps, 25℃	45000±10000
Density	g/cm³, 25℃	1.67±0.05
After curing
Hardness	Shore-D, 25℃	90±5
Glassification transition temperature TG	DSC, ℃	92.9
Long -term using temperature	℃	–55-85
Shear strength, steel-steel	MPa, 25℃	19
T -character stripping	N/25mm，25℃	3.3
Linear expansion coefficient	ppm	50, <Tg 120, >Tg
Dielectric strength	KV/mm	18
Dungeon constant (500kHz)	–	3.2
Corporation of medium loss (500kHz)	–	0.0021
Volume resistivity (500V)	Ω· cm, DC500V	2.35×10¹⁵
CICC flow distance	mm	30-40
Water absorption	%（Test：24H/25℃）	0.29
Water absorption	%（Test：1H/Boiling water）	0.32

Application

It can be cured quickly at 90~120℃. Excellent adhesion, electrical properties, moisture resistance and mechanical properties after curing.

How to use

Applying process

If the epoxy glue is stored in a frozen environment, take it out and thaw it in a room temperature environment before use. In the sizing process, it should be avoided to reduce the consistency of the glue by exposing it to high temperature, unless it has been tested and proved feasible in advance.
Apply the glue directly to the surface of the object to be bonded after degreasing, derusting and roughening. Select appropriate tools to assist the glue and fix it with fixture. It is then cured according to the recommended heating conditions.