MDPU 8110(6030)-K Fast cured Polyurethane potting gel

Conventional performance

Post-cure characteristics

Typical application

• This product is often used in electronic capacitors, automotive electronic module potting;
• Household appliances such as lampblack stove, microwave oven, rice cooker, washing machine, air conditioning control PCB board filling glue seal;
• Life smart toilet, induction toilet, metal induction garbage can circuit board and magnetic coil of moisture and waterproof potting protection.

Operation process

• Pre-drying: dehumidify the items and circuit boards that need to be poked at 50 degrees, and transfer them to the area to be filled with glue after pre-drying.
• Mixing: Weigh A and B materials proportionally. Stir vertically with the mixing rod, and stir clockwise (or counterclockwise) in the same direction for 2 to 3 minutes to minimize the mixing of air. Pay attention to the bottom of the container, the edge of the part should also be stirred evenly, otherwise there will be local non-curing phenomenon. During the entire operation process, A, B glue, mixing containers, mixing tools, etc. should avoid contact with water and moisture. The working environment is best adjusted by air conditioning, constant temperature and humidity (temperature 23 ° C, humidity 50%).
• Defoaming: For the potting surface requires smooth and no bubbles, the mixture should be vacuumed (≤-0.1mpa) to remove bubbles. Stirring while vacuuming dynamic debubbling, more conducive to the removal of bubbles. If mechanical metering is used for mixed potting, steps 1 and 2 are omitted. (It is recommended to use an automatic mixing device, which not only mixes accurately in the correct ratio, but also does not introduce air to create bubbles.)
• Pouring: Pour the mixture into the device. If the device has a complex structure and a large volume, it should be poured in batches. The pouring bubbles can be blown with a hot air gun. Surface bubbles can be eliminated.
• Component A and B must be sealed and stored. If it is not used up at one time, cover the bucket again and store it sealed. In particular, for component B, please minimize the contact time with the air during each use.
• Mix component A and component B proportionally and evenly in a short period of time, and the mixed glue can only be used within a limited time (operable time), otherwise it will not be used.
• The curing time is related to the amount and temperature of each mixing, and the curing time will be relatively shortened when the amount is large or the temperature is high. On the contrary, the curing time will be longer.
• The glue before curing is easier to clean, and the glue after curing should be cleaned, soaked, softened and peeled with methylene chloride.
• Curing: 25℃/24h or 80℃/1h can be cured. The ambient humidity should be controlled at <50%, and the curing time should be extended when the temperature is low.
• Equipment gluing only need to vacuum the AB material in the tank, measure and mix it into the object to be filled sealed, and then solidify or dry through the tunnel furnace.