Semiconductors
There are many types of electronic modules, common types power module, power module, current or voltage regulator module, IGBT module, field effect module, rectifier module, IPM module,PIM module,silicon controlled module, frequency conversion module.
| Model | Application point | Product type | Component | Curing condition | Solution |
| MDGEL 6606 | IGBT | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | IGBT | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | IGBT | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDGEL 6606 | Thyristor | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | Thyristor | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | Thyristor | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDEP 3225FR | Thyristor | Epoxy | 2K | Room temperature/heat cure | The terminal is potting and fixed |
| MDGEL 6606 | Thyristor | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | Thyristor | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | Thyristor | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDEP 3225FR | Thyristor | Epoxy | 2K | Room temperature/heat cure | Fixing of terminal potting |
| MDEP 3115 | Rectifier bridge | Epoxy | 2K | Room temperature/heat cure | Terminal potting |
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There are many types of electronic modules, common types power module, power module, current or voltage regulator module, IGBT module, field effect module, rectifier module, IPM module,PIM module,silicon controlled module, frequency conversion module.
| Model | Application point | Product type | Component | Curing condition | Solution |
| MDGEL 6606 | IGBT | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | IGBT | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | IGBT | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDGEL 6606 | Thyristor | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | Thyristor | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | Thyristor | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDEP 3225FR | Thyristor | Epoxy | 2K | Room temperature/heat cure | The terminal is potting and fixed |
| MDGEL 6606 | Thyristor | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | Thyristor | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | Thyristor | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDEP 3225FR | Thyristor | Epoxy | 2K | Room temperature/heat cure | Fixing of terminal potting |
| MDEP 3115 | Rectifier bridge | Epoxy | 2K | Room temperature/heat cure | Terminal potting |
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Ask for Sample&TDS
There are many types of electronic modules, common types power module, power module, current or voltage regulator module, IGBT module, field effect module, rectifier module, IPM module,PIM module,silicon controlled module, frequency conversion module.
| Model | Application point | Product type | Component | Curing condition | Solution |
| MDGEL 6606 | IGBT | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | IGBT | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | IGBT | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDGEL 6606 | Thyristor | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | Thyristor | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | Thyristor | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDEP 3225FR | Thyristor | Epoxy | 2K | Room temperature/heat cure | The terminal is potting and fixed |
| MDGEL 6606 | Thyristor | Silicone | 2K | Room temperature/heat cure | Chip potting protection |
| MDSI 7435 | Thyristor | Silicone | 1K | heat curing | Bonding of heat dissipation plate and housing |
| MDSI 7500 | Thyristor | Silicone | 1K | heat curing | Bonding of ceramic substrate and heat dissipation plate |
| MDEP 3225FR | Thyristor | Epoxy | 2K | Room temperature/heat cure | Fixing of terminal potting |
| MDEP 3115 | Rectifier bridge | Epoxy | 2K | Room temperature/heat cure | Terminal potting |
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Our thermosetting one-component epoxy adhesives meet the requirements of sealing triode package holes. Maidao's organic silicone plays a key role in the bonding of tantalum capacitor growth barrier lines and chips.
| Model | Application point | Product type | Component | Curing condition | Solution |
| MDEP 3688 | Triode | Epoxy | 1K | Heat curing | Sealing of package holes |
| MDEP 3688-15 | Triode | Epoxy | 1K | Heat curing | Sealing of package holes |
| MDPM 1263 | Tantalum capacitor | / | 1K | / | Silicone base coating |
| MDSI 7001 | Tantalum capacitor | Silicone | 1K | Room temperature | Glue for growing barrier lines |
| MDSI 7435 | Tantalum capacitor | Silicone | 1K | Heat curing | Chip bonding adhesive |
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