MDSI 7881 Silicone UV Curing Gel

Typical physical property data

• CIPG, FIPG or enclosing dam
• Automotive electronic control panel
• Electronic circuit boards
• Aviation instrumentation
• Applications that do not transmit light but require rapid curing

Handling process

• Surface treatment: Before bonding, dust, moisture (moisture) and oil on the surface of the object to be coated must be removed first.
• Construction: PlaceMDSI 7881 directly on the part that needs to be sealed or bonded.
• Curing: LED 365nm UV curing, the energy needs to reach 4000mJ/cm2 or above, the higher the energy the faster the curing speed. Increasing the temperature after irradiation can speed up the curing speed. If you need good adhesion, it is recommended to heat 80℃ for 1 hour curing after UV irradiation or place at room temperature for more than 2 hours.
• If it is mercury lamp or metal halogen lamp, the effect is better, the best energy is 1000 mJ/cm2 or above, the higher the energy, the faster the curing speed; Increase the temperature to speed up the curing speed.
• Repair: Repair the sealed device, just use a blade to remove the glue covered on the component, and then install a new component, and then clean the area with a brush or solvent; It can also be cleaned with solvent, and then re-used with sealant after drying

Full curing parameters:

1. LED lamp (365nm) irradiation 60000mJ/ cm2 can be cured directly
2. Mercury lamp or metal halogen lamp 20 seconds irradiation can be directly cured forming.

The parameters of mercury lamp are as follows:

• UVA: 0.246W/ cm2
• UVB: 0.073W/ cm2
• UVC: 0.021W/ cm2
• UVV: 0.061W/ cm2

3. It should be noted that there is no good bonding force formed after just curing. The bond requires room temperature 25 degrees for 2-8 hours to form a good bond