MDEP 3090 Black/Clear Epoxy structure adhesive

Resistance to moisture, dirt, and other atmospheric components
High strength, excellent adhesion
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts
Stable mechanical and electrical properties between -50 and 120℃
It has good adhesion to plastic PC, glass fiber cloth and steel plate

Product description

MDEP 3090C semi-thixotropic epoxy adhesive is a two-component room temperature curing epoxy resin. Designed for bonding ceramic, metal, glass, plastic, rubber, paper, cloth and other materials.

A and B components are thoroughly mixed 1:1 (weight ratio or volume ratio) after use, the product has a 40 min operation time, after curing to form a transparent hard protective layer, and there is a black version.

Data Sheet

Test items			Test standard	Unit		MDEP 3090C A/B
A	Appearance		Visual	—		Translucent or black paste
	Viscosity		GB/T 2794-1995	mPa·s (25 ° C)		30,000±8,000
	Density		GB/T 13354-1992	g/cm3 (25 ° C)		1.18±0.05
B	Appearance		Visual	—		Cream-white translucent pulp
	Viscosity		GB/T 2794-1995	mPa·s (25 ° C)		70,000±15,000
	Density		GB/T 13354-1992	g/cm3 (25 ° C)		1.12±0.05
Before cured
Item		–		Units or conditions		MDEP 3090C A/B
Mix ratio		–		Weight ratio		100:100
Mix ratio		–		Volume ratio		100:100
Mixed viscosity		–		mPa·s (25 ° C)		50,000±10,000
Mixed density		–		g/cm3 (25 ° C)		1.15±0.05
Tack free time		–		min (25℃)		35±7
Initial curing time		–		25℃/mins		120
After cured
Items			Test standard	Unit	MDEP 3090C Transparent		MDEP 3090C Black
Hardness			GB/T531-2008	Shore D	85±5		85±5
Shear strength			GB6328-86	Mpa, Al/Al	13		13
Shear strength			GB6328-86	Mpa, Fe/ Fe	15		15
Shear strength			GB6328-86	Mpa, Fe/ Fe, After surface sanding	20		20
Coefficient of expansion			GB/T20673-2006	μm/ (m, ° C)	100		100
Water absorption			GB/T8810-2005	24h, 25 ° C, %	< 0.3		< 0.3
Dielectric strength			GB/T1693-2007	kV/m (25 ° C)	> 20		> 20
Loss factor			GB/T1693-2007	(1MHz) (25 ° C)	0.014		0.014
Dielectric constant			GB/T1693-2007	(1MHz) (25 ° C)	3.53		3.53
Volume Resistance			GB/T1692-92	(DC500V)Ω· cm	1.2×10¹⁵		1.2×10¹⁵

Application

Designed for bonding ceramic, metal, glass, plastic, rubber, paper, cloth and other materials.

How to use

Precautions for operation

50ml and double-barrel support, the use of 1:1 mixing glue gun construction, the glue of the first extrusion of the mixing tube is discharged, in order to prevent the uneven initial mixing resulting in poor bonding effect. Double barrel packaging should pay attention to the sealing of the material port, and replace the mixing hose in time.
Manual use of bulk packaging, mixing adhesive materials need to be quickly weighed and stirred, this method is suitable for places with low bonding requirements; Otherwise, you need to use a two-component dispensing machine to mix and apply glue.
The temperature is too low will cause the curing speed to be slow, and when the initial strength cannot be reached, it needs to be controlled at the site by constant temperature.
Care needs to be taken to keep the Cartridge mouth sealed during use of cartridge packaging.