MDEP 3102 general epoxy potting compound

Low cost
Low viscosity and good fluidity
Wide application field
Low water absorption, good water and moisture resistance

Product description

MDEP 3102 A/B is a two-component solventless room temperature curing epoxy potting-sealing material, which is suitable for the packaging and protection of the products with thermal conductivity requirements in motors, automotive electronics, power tools, reactors and meters, and most of the plastic and metal substrates have excellent adhesion and temperature resistance.

Data Sheet

Test items		3102 White	3102 Black
Appearance, visual	Glue Solution A	White	Black
Appearance, visual	Glue Solution B	Colorless clear liquid	Brown liquid
Density, g/cm 25 ℃	Glue solution A	1.85±0.05	2.00±0.05
Density, g/cm 25 ℃	Glue Solution B	1.05±0.05	1.10±0.05
Mixing ratio	Mass ratio	5:1	100:20
Viscosity,cps 25 ℃	Glue solution A	11000±2000	20,000±6,000
Viscosity,cps 25 ℃	Glue Solution B	100±20	120±30
Operating time after mixing,min/150g		40±10	45±10
Hardness,Shore-D		≥70	85±5
Volume resistivity, ω.cm,25 ° C		3.1×10¹⁴	1.0×10¹⁴
Breakdown voltage,kV/mm,25 ° C		≥18	≥18
Dielectric constant,1.2MHz,25 ° C		3-5	3-5
Dielectric loss Angle tangent,1.2MHz		<0.01	<0.01
Cure shrinkage,%		<2	<2
Thermal conductivity, W/K.T		0.3-0.4	0.3-0.4
Shear strength,Fe-Fe,MPa		≥7	≥5
Use temperature range, ° C		-40～120	-40～120

Application

Suitable for the packaging and protection of the products with thermal conductivity requirements in motors, automotive electronics, power tools, reactors and meters, and most of the plastic and metal substrates have excellent adhesion and temperature resistance.

How to use

Operation Matters

Component A needs to be stirred evenly in the original package before use (precipitation may occur after a long time, and the performance will not be affected after the use of stirring evenly).
Affected by temperature, there are certain differences in the curing speed of glue in different seasons, and the curing time is longer in winter. All of the above glues can be heated to accelerate curing. You can also choose to use MDTECH winter formula.
The A and B components of some products may crystallize and caking under low temperature conditions, which is a normal phenomenon; Before use, put it in the oven at 80℃ to melt it, and put it to room temperature for normal use, without affecting the properties of the glue.
During the mixing process, pay attention to the glue on the inner wall of the container and stir it back to ensure the uniformity of mixing.