MDEP 3108 transparent epoxy potting compound

This product is a transparent color epoxy potting material
Resistant to moisture, dirt and other atmospheric components
High strength, excellent adhesion, cracking resistance, toughness
With secret acting, no solvent, no curing byproducts
Stable mechanical and electrical properties at -45-90℃

Product description

MDEP3108 series transparent epoxy potting compound is a room temperature/heat curing epoxy resin adhesive. This two-component epoxy adhesive is designed for potting, protecting electronic products that require high strength or confidentiality.

The MDEP3108 series of transparent epoxy potting compound cure without heat. After thoroughly mixing component A and component B by weight ratio, the product cures within a certain time to form protection.

Data Sheet

General performance

Testing Items	Units	MDEP 3108		MDEP 3108-2#		MDEP 3108-3#			MDEP 3108-7#
Testing Items	Units	A	B	A	B	A	B		A	B
Appearance	—	Colorless or light yellow clear liquid	Colorless and clear Liquid	Milky fluid	Colorless and clear Liquid	Milky fluid		Colorless and clear Liquid	Colorless or light yellow clear liquid	Colorless clear liquid
Viscosity	mPa·s, 25℃	440±50	100±20	440±50	100±20	600±150	100±20		13,000±2,000	100±20
Density	G/cm3, 25 ℃	1.12±0.05	1.02±0.05	1.12±0.05	1.02±0.05	1.12±0.05	1.02±0.05		1.14±0.05	1.02±0.05

Operation process

Item	Units or conditions	MDEP 3108	MDEP3108-2#	MDEP3108-3#	MDEP3108-7#
Mix ratio	Weight ratio	100:50	100:50	100:50	100:50
Mixing viscosity	mPa·s,25℃	200-300.	200-300.	200-300.	3000-5000.
Mix density	g/cm³,25℃	1.08	1.08	1.08	1.08
Operating time (1)	Hr,25℃	1	1	1	0.5
Curing time	℃/hr	80/1 or 25/24	80/1 or 25/24	80/1 or 25/24	80/1 or 25/24

(1) The operating time is tested by the dispensing amount of 100g, and the time is not flowing.

Take out the ratio of A and B components according to proportion, stir and mix evenly, remove bubbles by vacuuming, and pour onto the product to be potting during the operation period. If the potting product is too large, it is recommended to potting it several times, and then cure according to (60℃/90min or 25℃/24hr)

Typical properties

Items	Testing Criteria	Units	3108	# 3108-2	# 3108-3	# 3108-7
Colors	Eye tests	—	Colorless and transparent	Translucent white	Frosted white	Colorless and clear
Hardness	GB/T 531.1-2008	ShoreD	75±5	75±5	77±5	80±5
Shear strength	GB/T 7124-2008	Mpa, Fe-Fe	≥7	≥7	≥7	≥7
Thermal conductivity	GB/T 10297-1998	W/mK	0.27	0.27	0.27	0.27
Coefficient of expansion	GB/T 20673-2006	μm/ (m, ° C)	65	65	65	65
Water absorption	GB/T 8810-2005	24h, 25 ° C, %	<0.1	<0.1	<0.1	<0.1
Dielectric strength	GB/T 1693-2007	kV/mm (25 ° C)	>20	>20	>20	>20
Loss factor	GB/T 1693-2007	(1MHz) (25 ° C)	0.014	0.014	0.014	0.014
Dielectric constant	GB/T 1693-2007	(1MHz) (25 ° C)	3.53	3.53	3.53	3.53
Volume resistance	GB/T 1692-92	(DC500V) Ω· cm	1.2×10¹⁵	1.2×10¹⁵	1.2×10¹⁵	1.2×10¹⁵

Note: All the above data were determined after 7 days of adhesive curing at 25℃, 55%RH.

Application

Suitable for hard light strip, display module, photoelectric sensor, smart water meter and other photoelectric display devices and products.

How to use

Precautions for operation

Stir well before use. A and B should be sealed and stored after use.
When mixing, pay attention to stirring in the same direction, otherwise too many bubbles will be mixed; The container frame and the bottom of the glue should also be stirred evenly, otherwise there will be uneven mixing caused by local non-curing phenomenon.
Pouring onto the product and vacuuming again to remove bubbles can improve the comprehensive performance of the cured product.
Too low temperature will lead to slow curing speed, it is recommended to heat curing; Potting thickness of more than 2cm can not be cured directly at 100℃, so as not to cause detonation.
This glue curing process is exothermic reaction, the amount of glue will affect the length of the operation time, so the operation time under the amount of glue 100g is only a reference time.