MDEP 3112(1#) Black epoxy potting compound

Excellent adhesion, cracking resistance
Low CTE linear expansion coefficient
Excellent electrical insulation and thermal stability
Low water absorption, good water and moisture resistance

Product description

MDEP 3112(1#)A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing adhesive, the product conforms to UL 94 V-0 flame retardant grade, suitable for motor, automotive electronics, power tools, reactors, meters and other packaging protection, and most of the plastic and metal substrate has excellent adhesion and temperature resistance.

Excellent adhesion, cracking resistance
Low CTE linear expansion coefficient
Excellent electrical insulation and thermal stability
Low water absorption, good water and moisture resistance

Data Sheet

Test items	Test standard	Units	A	B
Color	Visual	—	Black paste	Brown liquid
Viscosity	GB/T 2794-2022	25℃, cps	15,000±3,500 (64#16rpm)	115±35 (61#20rpm)
Density	GB/T 13354-1992	25℃，g/cm3	1.75±0.05	1.05±0.05
Mixing ratio	Mass ratio	Ratio=A:B	100:20
Mixing viscosity	GB/T 2794-2022	25℃, cps	2,500±1,000 (64#170rpm)
Operating time	GB/T 10247-2008	25℃, min, 150g	55±15
Gel time	GB/T 10247-2008	25℃，hr	4-8hr
Hardness	GB/T 531.1-2008	Shore D, 30g	85±5
Thermal conductivity	GB/T 10297-1998	W/mK	0.5
Coefficient of expansion	GB/T 20673-2006	μm/ (m, ℃)	<Tg, 36 >Tg, 85
Glass transition temperature	GB/T 22567-2008	℃	65
Shear strength	GB/T 7124-2008	Mpa, Steel/steel	≥4
Impact strength	GB/T 1843-2008	KJ/m2	8
Dielectric strength	GB/T 1693-2007	kV/mm (25℃)	≥18
Loss factor	GB/T 1693-2007	(1MHz) (25℃)	0.05
Dielectric constant	GB/T 1693-2007	(1MHz) (25℃)	3.6
Volume resistance	GB/T 1692-92	DC500V,Ω· cm	1.0E +14
Flame retardant rating	UL	UL 94	V-0
Temperature for use	—	℃	– 50-120

Application

Suitable for automotive, automotive electronics, power tools, reactors, meters, sensors, photoelectric LED, lighting products and other products requiring high thermal conductivity packaging protection

How to use

Operation process

Glue: Because the filler contained in component A will precipitate with the time of placement, so before use, the A component is stirred evenly in the original package, and then the A and B components are weighed according to the weight ratio of 100:20, and can be potting after mixing evenly.
The amount of glue mixed according to the difference in the operation and use time of the mixing amount is different, for example, the mixing 1kg of glue must be used up within 15mins, and 500g of glue must be used up within 25mins to ensure that the filling of glue produces as few bubbles as possible and better filling performance of the filling device.
If necessary, the device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
Curing conditions: 25℃*24 hours or 80℃*2 hours.
If you need to use glue filling equipment, please consult our Marketing Department.