MDEP 3113 Thermal conductivity Epoxy potting compound

Excellent adhesion and cracking resistance
Low CTE linear expansion coefficient
High thermal conductivity
Excellent electrical insulation and stability
It can be used for a long time at 150℃-180℃
Water absorption is very low, good water and moisture resistance

Product description

MDEP 3113A/B is a two-component solvent-free, room temperature curing epoxy potting-sealing material, suitable for motors, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product packaging protection, and has excellent adhesion and temperature resistance.

Data Sheet

Test items	Test criteria	Units	MDEP 3113 A	MDEP 3113 B
Exterior	Eye survey	—	Black paste	Colorless or light yellow clear liquid
Viscosity	GB/T 2794-2013	25 ° C, mPa·s	27,000±7,000	20±5
Density	GB/T 13354-1992	25 ° C, g/cm3	2.40±0.05	0.95±0.05
Mixing ratio	Mass ratio	Ratio=A:B	100：8
Mixing initial viscosity	GB/T 2794-2013	25 ° C, mPa·s	2,000±500
Operating time	GB/T 10247-2008	25 ° C, min	60±20
Gel time	GB/T 10247-2008	60 ° C, min	60
Hardness	GB/T 531.1-2008	Shore D	90±5
Thermal conductivity	GB/T 10297-1998	W/mK	0.9-1.0
Coefficient of expansion	GB/T 20673-2006	μm/ (m, ° C)	20
Glass transition temperature	DSC	℃	95
Shear strength	GB/T 7124-2008	Mpa, Fe-Fe Mpa, Al-Al	≥4 ≥8
Dielectric strength	GB/T 1693-2007	kV/mm (25 ° C)	≥18
Loss factor	GB/T 1693-2007	(1MHz) (25 ° C)	0.09
Dielectric constant	GB/T 1693-2007	(1MHz) (25 ° C)	2.9
Volume Resistance	GB/T 1692-92	DC500V,Ω· cm	1.00E +15
Use temperature	GBT 20028-2005	℃	-50–180

Application

Suitable for motors, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product packaging protection, and has excellent adhesion and temperature resistance.

How to use

Operation process

Mixing: Because the filler contained in component A will precipitate with the time of placement, it is necessary to mix component A in the original package before use, and then weigh component A and component B according to the weight ratio of 100:8, and then potting can be done after mixing evenly.
Component B in the storage process may appear crystallization or agglomeration (belongs to the normal situation), if the crystallization needs to be placed in the 80℃ oven to melt it before use, and then cold to room temperature after use, this will not affect its performance.
Exposed in the air, component B will react with moisture to produce hydrolysis, and the hydrolysis product is a white powdery substance. Try to avoid pouring white material when weighing.
If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
Curing condition: 25℃*24 hours. For better performance, please follow the curing process of 100℃*2 hours or 80℃*3 hours.
If you need to use glue filling equipment, please consult our Marketing Department.