MDEP 3115 flame retardant epoxy potting compound

Excellent adhesion and cracking resistance
Low CTE linear expansion coefficient
Can be cured at room temperature or by heating
Excellent electrical insulation and stability
Good permeability after preheating
Suitable for space filling of various sizes

Product description

MDEP 3115A/B is a spatial structure potting resin for high and low temperature impact requirements, in accordance with 100: 15 Weight ratio weighing and mixing, through the potting equipment supporting automatic production line, through preheating, mixing, gluing, vacuuming and heating or room temperature curing, to form a good bonding of metals and common polar plastics, and can withstand the equivalent environmental high and low temperature impact test, as well as constant temperature and humidity after the verification of physical characteristics and chemical properties. The product meets the flame retardant rating requirements of UL 94 V-0 and has considerable thermal conductivity.

Data Sheet

Technical parameters

Test items	Test standard	Units	MDEP 3115 A	MDEP 3115 B
Color	Visual	—	Black fluid	Black liquid
Viscosity	GB/T 10247-2008	25℃，mPa·s	32000±7000	70±15
Density	GB/T 13354-92	25℃，g/cm3	1.74±0.05	0.97±0.05
Mixing ratio	Mass ratio	Ratio=A:B	100：15
Mixing viscosity	GB/T 10247-2008	25℃，mPa·s	2,500±700
Operating time	GB/T 10247-2008	25℃ , min	60±15
Gel time	GB/T 10247-2008	25℃，Hour	4
Curing time	GB/T 10247-2008	25℃，Hour 80℃，Hour	24 2
Hardness	GB/T 531.1-2008	Shore D，25℃	90±5
Thermal conductivity	GB/T 10297-1998	W/mK	0.6
Coefficient of expansion	GB/T 20673-2006	μm/（m，℃）	42， < Tg 102， > Tg
Glass transition temperature	DSC	℃	80℃
Shear strength	GB 6328-86	Mpa	≥16
Dielectric strength	GB/T 1693-2007	kV/mm（25℃）	≥18
Dielectric loss	GB/T 1693-2007	（1MHz）(25℃)	0.01
Dielectric constant	GB/T 1693-2007	（1MHz）(25℃)	3.6
Volume resistance	GB/T 1692-92	DC500V,Ω·cm	1.00E +14
Service temperature	GBT 20028-2005	℃	-50-180

Note :1. The curing condition of the above data test was 80℃* 2h

The data in the table are measured data under specific conditions and are for reference only. There is no guarantee that the data obtained by customers in the actual use process can be completely consistent with it.

Application

Application

Power module, high voltage DC contactor
Permanent magnet motor stator, high voltage power supply
Tank type reactor, high voltage capacitor
Power tools, instruments and other packaging protection

How to use

Operation process

Mixing: Because the filler contained in component A will precipitate with the time of placement, component A will be stirred evenly in the original package before use, and then component A and B will be weighed according to the weight ratio of 100:15, and can be potting after being mixed evenly.
The amount of glue mixed according to the difference in the operation and use time of the mixing amount is different, for example, the mixing 1kg of glue must be used up within 15mins, and 500g of glue must be used up within 25mins to ensure that the filling of glue produces as few bubbles as possible and better filling performance of the filling device.
If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
Curing conditions: 25℃*24 hours or 80℃*2 hours.
If you need to use glue filling equipment, please consult our Marketing Department.