MDEP 3115#3517 Flexible epoxy potting compound

Excellent adhesion and crack resistance
It has a relatively high thermal conductivity
Excellent electrical insulation and stability
It can be used within the temperature range of -50℃ to 200℃
It has a low water absorption rate and excellent water and moisture resistance
It has excellent adhesion to metals (iron, aluminium and copper)
30-50 Shore D hardness

MDEP 3115 (3517) A/B is a two-component solvent-free Flexible epoxy potting compound that cures at room temperature. It is suitable for the encapsulation and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and instruments, and has good adhesion and insulation performance.

Data Sheet

Test items	Test standard	Unit		Part A	Part B
Colour	Visual	—		Black plasma	Colorless or pale yellow transparent liquid
Viscosity	GB/T 2794-2022	25℃，mPa·s		25,000±5,000	50±20
Density	GB/T 13354-1992	25℃，g/cm³		1.65±0.05	1.0±0.05
Mixing ratio	Mass ratio	Ratio=A:B		100：20
Mixed viscosity	GB/T 2794-2022	150g,mPa·s	25℃	2,000±500
Operation time	GB/T 2794-2022	A+B=150g, min		40-80
Gel time	GB/T 2794-2022	25℃，hr		≥5
Hardness	GB/T 531-2008	Shore D		30-50
Thermal conductivity coefficient	GB/T 10297-2015	W/（m·K）		0.7
Shear strength	GB/T 7124-2008	Mpa, Iron-Iron		≥2.5
Curing shrinkage rate	HG/T 2625-1994	%		≤1.2
Dielectric strength	GB/T 1693-2007	kV/mm（25℃）		≥14
Loss factor	GB/T 1693-2007	（1MHz）(25℃)		≤0.005
Dielectric constant	GB/T 1693-2007	（1MHz）(25℃)		≤2.8
Volume resistance	GB/T 1692-2008	DC500V,Ω· cm		≥1.0E +11

It is suitable for the encapsulation and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and instruments, and has good adhesion and insulation performance.

How to use

Operation process

Mixing: Due to sedimentation of fillers in Component A over time, stir Component A thoroughly in its original container before use. Weigh Components A and B in a 100:20 weight ratio, mix uniformly, and proceed with potting.
Component B may crystallize or form lumps during storage (normal behavior). If crystallization occurs, melt it in an 80°C oven before use, then cool to room temperature. This does not affect its performance.
Component B reacts with moisture in the air, producing a white powdery residue (hydrolysis byproduct). Avoid introducing this residue during weighing.
Mixing may entrap air bubbles. Perform vacuum defoaming to enhance the electrical performance of the final product.
If Component A is too viscous, preheat it at 40°C before mixing with Component B (100:20 ratio).
Initial curing conditions: 25℃ for 24 hours or curing at 80℃ for 2 hours as designed after potting.
Customers can adjust the curing temperature and time according to the actual size and dimensions of the potting object. The smaller the size, the shorter the curing time.
For machine potting, consult our marketing department.
Heat Components A and B separately in tanks to reduce viscosity, improving flow and penetration during potting.
The amount of Component B in the curing agent—whether higher or lower than the normal ratio—will reduce the product’s hardness at elevated temperatures.
The greater the difference in the addition amount of component B of the curing agent, the greater the hardness change of the colloid and the worse its temperature resistance.