MDEP 3118 Clear Epoxy structure potting compound
- Resistance to moisture, dirt, and other atmospheric components
- High strength, good adhesion
- Good pollution resistance, low requirements for surface pretreatment
- No solvent, no curing byproducts
- It has stable mechanical and electrical properties in the range of -50 ~ 120℃
- It has good adhesion to plastic PC, glass fiber cloth and steel plate
MDEP 3118 Clear Epoxy structure potting compound is a fast curing epoxy adhesive. This product is a two-component epoxy adhesive, suitable for bonding ceramic, metal, glass, plastic, rubber, paper, cloth and other products.
MDEP 3118 Clear Epoxy structure potting compound cures without heating. After the A and B components are fully mixed according to 3:1(weight or volume ratio), the product runs for 2 hours longer, the foaming performance is good, and the transparent hard protective layer is formed after curing.
| Test items | Test standard | Unit | MDEP 3118 A/B | ||
| A | Appearance | Visual | — | Colorless or light yellow clear liquid | |
| Viscosity | GB/10247-2008 | mPa·s (25 ° C) | 10,000-15,000 | ||
| Density | GB/T 13354-92 | g/cm3 (25 ° C) | 1.15±0.05 | ||
| B | Appearance | Visual | — | Colorless or light yellow transparent liquid | |
| Viscosity | GB/10247-2008 | mPa·s (25 ° C) | 10-26 | ||
| Density | GB/T 13354-92 | g/cm3 (25 ° C) | 0.95±0.05 | ||
| Before cured | |||||
| Items | Units or conditions | MDEP 3118 A/B | |||
| Mix ratio | Weight ratio | 3:1 | |||
| Mixing ratio | Volume ratio | 3:1 | |||
| Mix viscosity | mPa·s (25 ° C) | 300-500. | |||
| Mix density | g/cm3 (25 ° C) | 1.10 | |||
| Operation time (1) Time to stir viscosity to 2000cps | min (25 ° C) | 120-200. | |||
| Precure time | 25℃/hr | 24 | |||
| After cured | |||||
| Item | Test standard | Unit | MDEP 3118 A/B | ||
| Hardness | GB/T 531.1-2008 | Shore D | 80±5 | ||
| Shear strength (AI-AI) | GB 6328-86 | Mpa, Al/Al | ≥13 | ||
| Shear strength (PC-PC) | GB 6328-86 | Mpa, PC/ PC | ≥5 | ||
| Coefficient of expansion | GB/T 20673-2006 | μm/ (m, ° C) | 65 | ||
| Water absorption | GB/T 8810-2005 | 24h, 25 ° C, % | < 0.3 | ||
| Dielectric strength | GB/T 1693-2007 | kV/mm (25 ° C) | ≥16 | ||
| Loss factor | GB/T 1693-2007 | (1MHz) (25 ° C) | 0.014 | ||
| Dielectric constant | GB/T 1693-2007 | (1MHz) (25 ° C) | ≥3.0 | ||
| Volume resistance | GB/T 1692-92 | (DC500V) Ω· cm | 1.2×1015 | ||
Suitable for bonding ceramic, metal, glass, plastic, rubber, paper, cloth and other products.
Operation process
- When manually using bulk packaging, mixing glue material needs to be weighed and quickly stirred, this method is suitable for equipment with low bubble requirements; Otherwise, two-component rubber can be used to mix rubber.
- Too low a temperature will result in a slow curing speed, and when the initial strength cannot be reached, constant temperature control is required on site.
- The curing process of this glue is exothermic reaction, and the amount of glue will affect the operation time, so the operation time under the amount of glue 160g is only the reference time
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