MDEP 3209 High temperature Epoxy Structural adhesive
- Resistance to moisture, dirt, and other atmospheric components
- High strength, excellent adhesion
- Good pollution resistance, low surface pretreatment requirements
- No solvent, no curing byproducts
- Excellent high and low temperature resistance, -50℃-180℃
- Transformer oil resistance, low attenuation
- It has good adhesion to glass fiber cloth, aluminum and plastic, aluminum and aluminum and steel plate
MDEP 3209A/B Epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component bonding adhesive is designed for metal bonding, bonding of cube or SMC fiberglass parts, aluminum honeycomb plate splicing and magnetic steel tile bonding of motor products, ceramic film component sealing, internal structure bonding of lithium battery module, soft magnetic unit potting, high temperature sensor potting, etc.
MDEP 3209A/B epoxy adhesive can cure in both room temperature and heating environment. After thoroughly mixing component A and component B at 100:50 (weight ratio), the product cures within a certain period of time to form protection.
| Test items | Test standard | Unit | Part A | Part B |
| Appearance | Visual | — | Black paste | Beige paste |
| Viscosity | GB/T 2794-2022 | 25 ° C, mPa·s | 350,000±10,000 | 30,000±70,000 |
| Density | GB/T 13354-1992 | 25 ° C, g/cm3 | 1.12±0.05 | 1.03±0.05 |
| Mixing ratio | Mass ratio | Ratio=A:B | 100:50 | |
| Mixing ratio | Volume ratio | Ratio=A:B | 100:50 | |
| Mixing viscosity | GB/T 2794-2022 | 25 ° C, Pa·s | 150,000±30,000 | |
| Operating time | GB/T 2794-2022 | 25 ° C, 100g, min | 70±10 | |
| Hardness | GB/T 531.1-2008 | Shore D | 85±5 | |
| Peel strength | GB/T 528-2009 | Kgf/cm2, Fe/Fe | 240 | |
| Kgf/cm2, AI/AI | 226 | |||
| T-peel strength | GB/T 2791-1995 | N/mm(25℃) | 6 | |
| Shear strength | GB/T 7124-2008 | mPa·s | ≥20 | |
| Impact strength | GB/T 1843-2008 | KJ/m2 | 15 | |
| Glass transition temperature | GB/T 22567-2008 | ℃ | 110 | |
| Coefficient of thermal expansion | GB/T 1036-2008 | U m/m / ℃ | <Tg, 45
>Tg, 152 |
|
| Thermal cracking temperature | TGA 10℃/min | ℃ | 290 | |
| Water absorption | GB/T 8810-2005 | 24h, 25 ° C, % | 0.45 | |
| Dielectric strength | GB/T 1692-2008 | kV/mm (25 ° C) | 22 | |
| Dielectric loss | GB/T 1693-2007 | (1MHz) (25 ° C) | 0.006 | |
| Dielectric constant | GB/T 1693-2007 | (1MHz) (25 ° C) | 3.1 | |
| Volume resistance | GB/T 1692-2008 | DC500V,Ω· cm | 5.20E +14 | |
Designed for metal bonding, bonding of cube or SMC fiberglass parts, aluminum honeycomb plate splicing and magnetic steel tile bonding of motor products, ceramic film component sealing, internal structure bonding of lithium battery module, soft magnetic unit potting, high temperature sensor potting, etc.
Operation process
- Gluing: After stirring the A component in the original package, the A and B components are weighed according to the weight ratio of 100:50.
- After the vacuum defoaming is stirred evenly, it will be used up within 80 minutes.
- The potting device can continue to be vacuumed if necessary, which is conducive to increasing the electrical performance of the device.
- Curing conditions: 120℃*2hour, 40℃*16 hours or 25℃*24 hours.
- If you need to use glue filling equipment, please consult our Marketing Department.
- Double tube packaging (2:1 volume ratio), directly use the glue gun for sizing, 5-10 cm glue liquid at the front of the mixing tube is squeezed out before normal use.
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