MDEP 321 One Compound Epoxy Adhesive

One components epoxy adhesive
Black paste epoxy structure adhesive
No solvent, no curing byproducts
Good toughness and impact strength
It has good adhesion to most substrates including glass, metal, ceramics

Product description

MDEP 321 New is a black and solvent-free single component epoxy structural adhesive, this product has good toughness and impact strength, when it is fully cured by heat, it can provide excellent bonding properties, electrical properties, moisture resistance and mechanical properties, and has high bonding strength for most substrates including glass, metal, ceramics, etc. At the same time can meet the high temperature bonding and mechanical performance requirements, widely used in automotive electronics, pressure sensors, wiring harnesses, motor magnetic sheet bonding.

Data Sheet

Item	Test method or condition	MDEP 321
Appearance	Visual	Black paste
Viscosity	Rotor 93C, 5rpm, Pa·s, 25 ° C	112
Viscosity	Rotor 93C, 0.5rpm, mPa·s, 25 ° C	110000±30000
Thixotropic index	–	2.5
Density	g/cm3, 25℃	1.30±0.05
Flow hanging	Dripping on the slide, Place in the oven at 90° vertical to cure	Size < 10mm(0.2g) Size < 12mm(0.35g)
Hardness	Shore-D, 25℃	85±5
Glass transition temperature Tg	DSC, ℃	145
Long-term temperature range	℃	– 50-180
Shear strength, steel-steel	MPa, 25℃	≥20
	MPa, 120℃	24
	MPa, 150℃	19
Shear strength, galvanized sheet	MPa, 25℃	18
	MPa, 120℃	17
	MPa, 150℃	13
Impact strength	KJ/m2, 25 ° C	> 6
Coefficient of linear expansion	ppm	45, <Tg 100, >Tg
Volume Resistance	Ω· cm, DC500V	1.0 x 10¹⁵

Application

Provide excellent bonding properties, electrical properties, moisture resistance and mechanical properties, and has high bonding strength for most substrates including glass, metal, ceramics, etc. At the same time can meet the high temperature bonding and mechanical performance requirements, widely used in automotive electronics, pressure sensors, wiring harnesses, motor magnetic sheet bonding.

How to use

Use process

If the epoxy glue is stored in a frozen environment, it should be removed to a normal temperature environment before use. During the sizing process, avoid exposing the glue to high temperatures to reduce the consistency of the glue, unless this has been previously tested and proved to be feasible.
Apply the glue directly to the surface of the object to be bonded after oil removal, rust removal and roughening treatment, select appropriate tools to assist the glue application, and fix it with a fixture. Then cure according to the recommended heating conditions.