MDEP 3211 High strength Epoxy structure adhesive

Resistance to moisture, dirt, and other atmospheric components
High strength, excellent adhesion
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts
Excellent high and low temperature resistance, -50℃-150℃
It has good adhesion to glass fiber cloth and steel plate

MDEP 3211 is a room temperature/heat curing High strength Epoxy structure adhesive. This two-component adhesive is designed for metal bonding, SMC FRP parts bonding, aluminum honeycomb plate splicing and Nomex paper bonding for motor products.

MDEP 3211 High strength Epoxy structure adhesive can cure at room temperature and heating environment. After thoroughly mixing component A and component B at 1:1 (weight ratio), the product solidifies within a certain time to form protection.

Data Sheet

Conventional properties

			MDEP 3211 Gray		MDEP 3211 Black
Test item	Test standard	Unit	Part A	Part B	Part A	Part B
Color	Visual	—	Black colloid	Beige colloid	Black paste	Beige paste
Viscosity	GB/T 2794-2013	mPa.s	The paste is slightly collapsed	The paste is slightly collapsed	170,000±30,000	200,000±50,000
Density	GB/T 13354-1992	g/cm3 (25 ° C)	1.50±0.05	1.30±0.05	1.60±0.05	1.50±0.05

Operation process

Item	Units or conditions	MDEP 3211 Grey	MDEP 3211 Black
Mix ratio	Weight ratio	100:100	100:100
Mix ratio	Volume ratio	100:100	100:100
Mix density	g/cm3 (25 ° C)	1.40±0.05	1.55±0.05
Operating time (1)	min (25 ° C)	80mins	110mins
Curing time	℃/min	60 ° C / 60 mins or 25 ° C 24 hrs

Curing speed

BEEP 6211 Black
Temperature, C	0	5	15	25	35	60	80
Operating time, h	8	5	1	0.5	0.3	0.1	0.05
Time to reach 50% bonding strength, h	72	48	24	12	8	0.5	0.1
Time to reach 100% bonding strength, h	240	96	48	30	16	2	0.5

The ambient temperature below 5℃ is not recommended to use, if used, it is necessary to warm the AB glue to more than 20℃ before construction, in order to obtain the best mixing effect. For the best curing speed, you can choose the method of heating curing or pre-drying the product of dispensing glue.

Typical performance

Item	Test standard	Unit	Numerical value
Hardness	GB/T 531.1-2008	Shore D	83
Shear strength	GB 7124-2008	Mpa, Fe/Fe	≥15
Thermal conductivity	GB/T 10297-1998	W/mK	0.4
Coefficient of expansion	GB/T 20673-2006	μm/ (m, ° C)	55
Water absorption	GB/T 8810-2005	24h, 25 ° C, %	< 0.3
Dielectric strength	GB/T 1693-2007	kV/mm (25 ° C)	> 20
Loss factor	GB/T 1693-2007	(1MHz) (25 ° C)	0.014
Dielectric constant	GB/T 1693-2007	(1MHz) (25 ° C)	3.53
Volume Resistance	GB/T 1692-92	(DC500V) Ω· cm	1.2 x 1015

Note: All the above data were determined after 7 days of adhesive curing at 25℃, 55%RH.

Item		Test standard	Unit	Numerical value
Compressive strength	12hr	GB 11837-89	MPa	≥30
Compressive strength	24hr	GB 11837-89	MPa	≥55
Tensile strength	2hr	GB/T 528-2009	MPa	≥3
Tensile strength	24hr	GB/T 528-2009	MPa	≥30
Bonding strength		GB/T 7124-2008	Mpa, 8-figure mortar	> 8
Shrinkage rate		GBT15585-1995	%	< 1.5
Elongation at break		GB/T 528-1998	%	> 3
Temperature range		GBT 20028-2005	℃	-40 to 150

Burn-in performance

Curing Conditions	Substrate	Aging conditions	Shear strength MPa	Mode of destruction
Room temperature 7 days	SMC/SMC	High and low temperature impact (-40 ° C /30mins, 80 ° C /30mins, repeat 10 times)	9.2	90% substrate damage
	Al/Al		15.8	90% substrate damage
	Nomex paper /Nomex paper		4.6	80% substrate damage
80 ℃ / 2 hours	SMC/SMC	150° C /1 hour	8.5	100% substrate destruction
	Al/Al		12.6	100% substrate destruction
	Nomex paper /Nomex paper		2.3	48% substrate damage

Application

Used for SMC FRP parts bonding, aluminum honeycomb plate splicing and transformer motor core bonding, Nomex paper bonding, high-speed rail track repair, Rail transit metal and plastic, metal and composite bonding, etc.

How to use

Precautions for operation

Surface treatment. Use sandpaper or solvent to clean the sticky surface, remove the surface grease and dirt, and improve the bonding environment.
Barrel A, B material is recommended before use, please first stir A/B components, A, B should pay attention to sealed storage after use.
When mixing, attention should be paid to stirring in the same direction, otherwise too many bubbles will be mixed; The container frame and the bottom of the glue should also be stirred evenly, otherwise there will be uneven mixing caused by local non-curing phenomenon.
The temperature is too low will lead to slow curing speed, when the initial strength can not be reached, the need for constant temperature control in the field.