MDEP 3211-146 Epoxy structure adhesive for Metal bonding

Resistance to moisture, dirt, and other atmospheric components
High strength, excellent adhesion
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts
Excellent high and low temperature resistance, -50℃-180℃
Transformer oil resistance, low attenuation
It has good adhesion to glass fiber cloth and steel plate

Product description

3211-146 Epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component bonding adhesive is designed for metal bonding, bonding of sheltered or SMC fiberglass parts, aluminum honeycomb plate splicing and magnetic steel tile bonding of motor products, ceramic film component sealing, soft magnetic unit potting, high temperature sensor potting and so on.

3211-146 Epoxy adhesive can cure in both room temperature and heating environment. After thoroughly mixing component A and component B at 100:45 (weight ratio), the product cures within a certain time to form protection.

Data Sheet

Items	Test standard	Unit	MDEP 3211-146 Natural Colors	MDEP 3211-146 Black
Color	Visual	—	White translucent paste/yellow liquid	Black paste/yellow liquid
Viscosity	GB/T 2794-1995	25 ° C, mPa·s	150000±20000/40000±8000	150000±30000/40000±8000
Density	GB/T 13354-1992	25 ° C, g/cm3	1.15±0.05/1.00±0.05	1.15 ±0.05/1.00±0.05
Mixing ratio	Mass ratio	Ratio=A:B	100:45
Mixing ratio	Volume ratio	Ratio=A:B	100:50
Mixing viscosity	GB/T 10247-2008	25 ° C, Pa·s	120,000±20,000
Operating time	GB/T 10247-2008	25 ° C, 100g, min	70±10
Hardness	GB/T 531-2008	Shore D	80±5
Bonding Strength	GB 6328-86	Kgf/cm2, Fe/Fe	≥12
Bonding Strength	GB 6328-86	Kgf/cm2, AI/AI	≥10
T-peel strength	GB/T 2791-1995	N/mm(25℃)	≥5
Impact strength	GB/T 1843-2008	KJ/m2	15
Glass transition temperature	GB/T 22567-2008	℃	95
Coefficient of thermal expansion	GB/T 20673-2006	U m/m / ℃	<Tg, 45 >Tg, 152
Thermal cracking temperature	TGA 10℃/min	℃	290
Water absorption	GB/T 8810-2005	24h, 25 ° C, %	0.45
Dielectric strength	GB/T 1693-2007	kV/mm (25 ° C)	> 18
Dielectric loss	GB/T 1693-2007	(1MHz) (25 ° C)	0.009
Dielectric constant	GB/T 1693-2007	(1MHz) (25 ° C)	3.1
Volume resistance	GB/T 1692-92	DC500V,Ω· cm	1.0E +14

Application

For metal bonding, bonding of sheltered or SMC fiberglass parts, aluminum honeycomb plate splicing and magnetic steel tile bonding of motor products, ceramic film component sealing, soft magnetic unit potting, high temperature sensor potting and so on.

How to use

Precautions for operation

50ml and double-barrel support, the use of 1:1 mixing glue gun construction, the glue of the first extrusion of the mixing tube is discharged, in order to prevent the uneven initial mixing resulting in poor bonding effect. Double barrel packaging should pay attention to the sealing of the material port, and replace the mixing hose in time.
Manual use of bulk packaging, mixing adhesive materials need to be quickly weighed and stirred, this method is suitable for places with low bonding requirements; Otherwise, you need to use a two-component dispensing machine to mix and apply glue.
The temperature is too low will cause the curing speed to be slow, and when the initial strength cannot be reached, it needs to be controlled at the site by constant temperature.
Care needs to be taken to keep the Cartridge mouth sealed during use of cartridge packaging.
This glue curing process is an exothermic reaction, and the amount of glue will affect the length of operation time, so the operation time under the amount of glue 2g is only a reference time.