MDEP 3211-2JY Epoxy structure adhesive

  • Resistance to moisture, dirt, and other atmospheric components
  • High strength, excellent adhesion
  • Good pollution resistance, low surface pretreatment requirements
  • No solvent, no curing byproducts
  • Excellent high and low temperature resistance, -50℃-150℃
  • Transformer oil resistance, low attenuation
  • It has good adhesion to glass fiber cloth and steel plate

3211-2JY Epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component adhesive is designed for metal bonding, SMC fiberglass parts bonding, aluminum honeycomb plate splicing and Nomex paper bonding for electric motor products.

3211-2JY Epoxy bonding adhesive can cure at room temperature and heating environment. After thoroughly mixing component A and component B at 1:1 (weight ratio), the product solidifies in a certain time to form protection.

Conventional properties

Items Test standard Unit 3211-2JY
Part A Part B
Appearance Visual Gray-black viscous Beige viscous
Viscosity GB/T 2794-2013 mPa·s (25 ° C) 38,000±10,000 80,000±20,000
Density GB/T 13354-1992 g/cm3 (25 ° C) 1.45±0.05 1.40±0.05

Operation process

Items Units or conditions 3211-2JY
Mix Ratio Weight ratio 100:100
Mix ratio Volume ratio 100:100
Operating time min (25 ° C) 30±10
Curing time ℃/min 80℃ 90 mins or 25℃ 24hr

(1) The operating time is tested by the dispensing amount of 150g. This glue curing process is exothermic reaction, the amount of glue will affect the length of the operation time, so the operation time under the amount of glue 150g is only a reference time.

Take out the ratio of A and B components in proportion, stir and mix evenly, and then cure according to 80℃90 mins or 25℃ 24hr.

 

Typical properties

Items Test standard Unit Value
Color Visual Grey
Hardness GB/T 531-2008 Shore D 80±5
Shear strength GB 7124-2008 Mpa, Fe-Fe ≥16
Impact strength GB/T 3808-2002 KJ, Fe-Fe 22
Thermal conductivity GB/T 10297-1998 W/mK 0.4
Coefficient of expansion GB/T 20673-2006 μm/ (m, ° C) 44
Water absorption GB/T 8810-2005 24h, 25 ° C, % <0.3
Dielectric strength GB/T 1693-2007 kV/mm (25 ° C) >20
Loss factor GB/T 1693-2007 (1MHz) (25 ° C) 0.014
Dielectric constant GB/T 1693-2007 (1MHz) (25 ° C) 3.53
Volume Resistance GB/T 1692-92 DC500V, Ω · cm 1.2×1014

Note: All the above data were determined after 1.5hr curing in the glue 80℃ oven.

Designed for metal bonding, SMC fiberglass parts bonding, aluminum honeycomb plate splicing and Nomex paper bonding for electric motor products.

Precautions for operation

  • Barrel A, B material is recommended to stir A/B components before use, A, B should pay attention to sealed storage after use.
  • When mixing, attention should be paid to stirring in the same direction, otherwise too many bubbles will be mixed; The container frame and the bottom of the glue should also be stirred evenly, otherwise there will be uneven mixing caused by local non-curing phenomenon.
  • The temperature is too low will lead to slow curing speed, when the initial strength can not be reached, the need for constant temperature control in the field.
  • Care needs to be taken to keep the Cartridge mouth sealed during use of cartridge packaging.

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