MDEP 3225 Black Fast cured Epoxy structural adhesive

Resistance to moisture, dirt, and other atmospheric components
High strength, excellent adhesion
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts
Stable mechanical and electrical properties between -50 and 120℃
It has good adhesion to plastic PC, glass fiber cloth and steel plate

Product description

MDEP 3225 series epoxy adhesive is a two-component room temperature curing epoxy resin. Designed for bonding ceramic, metal, glass, plastic, rubber, paper, cloth and other materials.

A and B components are thoroughly mixed 1:1 (weight ratio or volume ratio) before use. The product has good toughness and aging resistance after curing, and the adhesive layer is not easy to be brittle after curing. At the same time, it has certain resistance to ultraviolet light and moisture, and can be used for local potting and bonding of outdoor mechanical equipment.

Data Sheet

Conventional properties

Item		Test standard	Unit	MDEP 3225
A	Appearance	Visual	—	Black slurry
	Viscosity	GB/T 2794-1995	mPa·s (25 ° C)	80,000±20,000
	Density	GB/T 13354-1992	g/cm3 (25 ° C)	1.25±0.05
B	Appearance	Visual	—	Cream-white paste
	Viscosity	GB/T 2794-1995	mPa·s (25 ° C)	36,000±9,000
	Density	GB/T 13354-1992	g/cm3 (25 ° C)	1.25±0.05

Operation process

Items	Units or conditions	MDEP 3225
Mix ratio	Weight ratio	100:100
Mix ratio	Volume ratio	100:100
Operating time (1)	min (25 ° C)	3±1
Tack free time (1)	min (25 ° C)	6±2
Initial curing time (1)	25℃/min	10±2

(1) The operating time is tested with the dispensing amount of 1g.

Take out the ratio of A and B components in proportion, stir and mix evenly, quickly apply to the part that needs bonding, and cure quickly in a short time.

Typical performance

Item	Test standard	Unit	MDEP 3225
Color	Visual	—	Black
Hardness	GB/T 531-2008	Shore D	80± 5
Shear strength	GB/T 7124-2008	Mpa, Al/Al	13
Shear strength	GB/T 7124-2008	Mpa, Fe/Fe	≥10
Coefficient of expansion	GB/T20673-2006	μm/ (m, ° C)	70
Water absorption	GB/T8810-2005	24h, 25 ° C, %	< 1
Dielectric strength	GB/T1693-2007	kV/m (25 ° C)	> 15
Loss factor	GB/T1693-2007	(1MHz) (25 ° C)	< 0.01
Dielectric constant	GB/T1693-2007	(1MHz) (25 ° C)	3.53
Volume Resistance	GB/T1692-92	(DC500V) Ω· cm	1.2 + 15 e

Note: The curing condition of all the above reliability data test is: 80℃/30min.

Application

Designed for bonding ceramic, metal, glass, plastic, rubber, paper, cloth and other materials.

How to use

Precautions for operation

50ml and double-barrel support, the use of 1:1 mixing glue gun construction, the glue of the first extrusion of the mixing tube is discharged, in order to prevent the uneven initial mixing resulting in poor bonding effect. Double barrel packaging should pay attention to the sealing of the material port, and replace the mixing hose in time.
Manual use of bulk packaging, mixing adhesive materials need to be quickly weighed and stirred, this method is suitable for places with low bonding requirements; Otherwise, you need to use a two-component dispensing machine to mix and apply glue.
The temperature is too low will cause the curing speed to be slow, and when the initial strength cannot be reached, it needs to be controlled at the site by constant temperature.
Care needs to be taken to keep the Cartridge mouth sealed during use of cartridge packaging.
This glue curing process is an exothermic reaction, and the amount of glue will affect the length of operation time, so the operation time of 1g or 5g glue is only a reference time. Users need to determine the amount of glue mixing or sizing process according to the actual needs of the amount of glue to control the production rhythm.