MDEP 3225(32a) High Tg 140℃ Epoxy potting compound

Low coefficient of linear expansion
Curing shrinkage
High hardness and good toughness
Excellent electrical insulation and thermal stability
Low viscosity
Temperature resistance Class H
Temperature resistance range -50-200℃
Good resistance to high and low temperature impact

Product description

MDEP 3225(32a)A/B is a two-component solvent-free heating and curing epoxy potting material with strong operation and excellent aging resistance at high and low temperatures.

Data Sheet

Test items	Test standard	unit	A	B
Color	Visual	—	Black or original color paste	Brown liquid
Viscosity	GB/T 2794-1995	25 ° C, mPa·s	70,000±20,000 (4#/5rpm)	45±15 (1#/60rpm)
Density	GB/T 13354-1992	25 ° C, g/cm3	1.80±0.05	1.2±0.05
Mixing ratio	Mass ratio	Ratio=A:B	100:20
Mixing viscosity	GB/T 2794-1995	mPa·s ,25℃	1,500±500
		mPa·s ,40℃	700±100
		mPa·s ,60℃	300±50
		mPa·s ,80℃	120±50
Operating time	GB/T 10247-2008	25 ℃	2h
		40 ℃	95min
		60 ℃	70min
		80 ℃	50min
Hardness	GB/T 531-2008	Shore D, 25℃	90±5
Glass transition temperature	DSC	℃	140
Thermal conductivity	GB/T 10297-1998	W/m.k	0.7
Shear strength	GB 6328-86	Mpa	10, Al-Al
Cure shrinkage rate	HG/T 2625-1994	%	0.90
Water absorption	GB/T 8810-2005	24h, 25 ° C, %	0.1
Dielectric strength	GB/T 1693-2007	kV/mm (25 ° C)	≥18
Dielectric loss	GB/T 1693-2007	(1MHz) (25 ° C)	0.002
Dielectric constant	GB/T 1693-2007	(1MHz) (25 ° C)	3.9
Volume resistance	GB/T 1692-92	DC500V,Ω· cm	1.0E +15

Application

Reactor, pressure sensor, temperature sensor, industrial control module, motor stator, etc

How to use

Operation process

Preparation: A\B material will have layered settlement during storage, so before each use, put the package into the oven at 60 ° C for 1 hour, and then take it out and stir evenly, at this time the viscosity will be lower than the viscosity at room temperature, and weigh in the case of temperature.
Glue: The A and B components are weighed according to the weight ratio of 100:20.
Stir evenly and set aside after vacuum debubbling.
If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
Curing conditions: 80℃*2h+130℃/2h.
If you need to use glue filling equipment, please consult our Marketing Department.