MDEP 3225(8#) Epoxy potting material

Excellent adhesion and resistance to cracking
Low CTE linear expansion coefficient
Excellent electrical insulation and thermal stability
Low water absorption, good water and moisture resistance

Product description

MDEP 3225(8#) is a two-component solvent-free room temperature curing epoxy potting material adhesive, the product meets the UL 94 V-0 flame retardant grade.

Data Sheet

Test items	Test Standard	Units	MDEP 3225(8#) A	MDEP 3225(8#) B
Color	Visual	—	Black liquid	Colorless or light yellow clear liquid
Viscosity	GB/T 2794-2022	25 ° C, cps	15,000±3,500	50±20
Density	GB/T 13354-1992	25 ° C, g/cm3	1.75±0.05	1.05±0.05
Mixing ratio	Mass ratio	Ratio=A:B	100：15
Mixed viscosity	GB/T 2794-2022	25 ° C, 224g,mPa·s	1,800±600
Operating time	GB/T 10247-2008	25 ° C, min	70±20
Gel time	GB/T 10247-2008	25 ° C, hr	4-8hr
Hardness	GB/T 531.1-2008	Shore D	25℃， 90±5
Thermal conductivity	GB/T 10297-2015	W/mK	0.56
Coefficient of expansion	GB/T 20673-2006	μm/ (m, ° C)	<Tg, 36 >Tg, 85
Glass transition temperature	GB/T 22567-2008	℃	60
Shear strength	GB/T 7124-2008	Mpa, iron-iron	≥15
Impact strength	GB/T 1843-2008	KJ/m2	8
Dielectric strength	GB/T 1695-2005	kV/mm (25 ° C)	≥18
Loss factor	GB/T 1693-2007	(1MHz) (25 ° C)	0.05
Dielectric constant	GB/T 1693-2007	(1MHz) (25 ° C)	2.8
Volume resistance	GB/T 1692-2008	DC500V,Ω· cm	1.0E +14
Flame retardant rating	UL	UL 94	V-0
Use temperature	—	℃	-50-180

Suitable for motor, automotive electronics, power tools, reactors, meters and other packaging protection, and most of the plastic and metal substrate has excellent adhesion and temperature resistance.

How to use

Operation process

Glue: Because the filler contained in component A will precipitate with the time of placement, so before use, the A component is stirred evenly in the original package, and then the A and B components are weighed according to the weight ratio of 100:15, and can be potting after mixing evenly.
According to the mixing amount of operation and use of time difference determined by the different amount of mixing glue, for example, mixing 1kg glue must be used up within 15mins, 500g glue must be used up within 25mins, to ensure that the filling of glue produced as little as possible bubbles and better filling performance of the filling device.
If necessary, the device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
Curing conditions: 25℃*24 hours or 80℃*2 hours.
If you need to use glue filling equipment, please consult our Marketing Department.