MDEP 3618 low temperature curing one component epoxy adhesive
- One components epoxy adhesive
- Low temperature curing one component epoxy adhesive
- Camera module CCD/CMOS border bonding
MDEP 3618 is a low temperature curing single component epoxy adhesive with high adhesion and low water absorption, which can be used to bond a variety of materials and has good storage stability.
| Test items | Test standard | MDEP 3618 |
| Before cured | ||
| Appearance | Visual | Black paste |
| Base chemical composition | Epoxy resin | |
| Viscosity,25 ° C, mPa·s | GB/T 2794-1995 | 21,000±3,000
|
| Density,g/cm3, 25 ° C | GB/T 13354-1992 | 1.64±0.05 |
| Curing conditions (1g) | / | 100℃*5min/80℃*30min/75℃*50min |
| After cured | ||
| Hardness Shore-D | GB/T 531-2008 | 85±5 |
| Elongation at break % | GB/T 1040-1992 | 5 |
| Shear strength MPa | GB/T 7124-2008 | TSS-Fe, ≥15
TSS-AI, 10 |
| Coefficient of thermal expansion | GB/T 1036-1989 | α1 (PPM/℃)，45
α2 (PPM/℃)，130 |
| Surface resistance Ω.cm | GB/T 1410-2006 | 1.0×1014 |
| Glass transition temperature (℃) | ASTM E1545 | 20 |
| Water absorption, %, 25℃*24h | GB/T 1034-1998 | 0.2 |
| Dielectric strength kv/mm | GB/T 1408.1-1999 | ≥15 |
Typical Applications
Mainly used for LED backlight module lens bonding, as well as camera module CCD/CMOS border bonding, suitable for temperature sensitive components bonding.
Instructions
- Before use, it must be cooled at room temperature for more than 4h, and do not open the package before returning to room temperature.
- The recommended dispensing pressure is 0.15-0.25MPa, the use of 21 or 22 needle, and the dispensing speed is 4-10mm/s.
- The application period is 3 days at 25 °
- The unused glue should be sealed in a plastic bag before being stored at -20℃.
- The amount of glue is 0.02g, and the curing condition is 80℃
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