MDEP 3663 Thermal conductive epoxy structure adhesive

One Compound Epoxy adhesive
Black or white paste
Good temperature resistance, low total chlorine.
High bonding strength, good toughness

Product description

MDEP 3663 is a kind of low-viscosity one-component high-performance epoxy resin structural adhesive developed for power electrical and electronic equipment towards miniaturization, lightweight and high output.

Data Sheet

Item	Test method or condition	Test standard	MDEP 3663
Appearance	Visual	—-	Black or white paste
Viscosity	mPa·s, 25℃	GB/T 2794-2013	45,000±10,000
Density	g/cm3, 25℃	GB/T 15223-1994	1.50 ±0.05
Shelf life	0 to 5 ° C	—-	6 months
Shelf life	20 to 25 ° C	—-	3 months
Hardness	Shore-D, 25℃	GB/T 531-2008	≥85
Glass transition temperature Tg	DSC, ℃	—-	115
Temperature range	℃	—-	– 50-155
Shear strength	MPa, steel-steel,25 ° C	GB/T 7124-2008	≥20

Application

It has the characteristics of good storage stability at room temperature, fast curing under heating conditions, high bonding strength, good toughness, excellent temperature resistance and weather resistance.

How to use

Precautions

Products should be stored in low temperature and cool place, it is recommended to store in the freezer.
Before each use, remove from the freezer to restore the glue to normal temperature. Unused glue must be stored in the freezer
After the storage period, if the viscosity is suitable, it can continue to use
This product is non-dangerous and can be transported under normal conditions
Please consult our Marketing Department if you need gluing equipment.