MDEP 3688(30#) High Tg Epoxy structure adhesive
- One components epoxy adhesive
- Black paste epoxy structure adhesive
- Good pollution resistance, low surface pretreatment requirements
- No solvent, no curing byproducts
- Good toughness and impact strength
- It has good adhesion to most substrates including glass, metal, ceramics
MDEP 3688(30#) is a black and solvent-free single component epoxy structural adhesive with good flow resistance, good toughness and resistance to high and low temperature impact, when it is fully cured by heat, it can provide excellent bonding properties, electrical properties, moisture resistance and mechanical properties, while meeting the performance requirements at high temperatures.
| Item | Test method or condition | Test standard | MDEP 3688(30#) |
| Appearance | Visual | —- | Black paste |
| Viscosity | mPa·s, 25℃, 96F/50rpm | GB/T 2794-1995 | 80,000 ± 12,000 |
| Vertical flow performance | mm | —- | Size < 10mm(0.2g)
Size < 12mm(0.35g) |
| Density | g/cm3, 25℃ | GB/T 15223-1994 | 1.33±0.05 |
| Hardness | Shore-D, 25℃ | GB/T 531-2008 | 85 ± 5 |
| Shore-D, 120℃ | GB/T 531-2008 | 85 | |
| Shore-D, 150℃ | GB/T 531-2008 | 82 | |
| Glass transition temperature Tg,
DSC, ℃ |
120 ℃/1h | GB/T 11998-1989 | 128 |
| 120 ℃/1h + 150℃/1h | GB/T 11998-1989 | 137 | |
| Long-term temperature range | ℃ | —- | – 50-180 |
| Tensile shear strength, steel-steel | MPa, 25℃ | GB/T 7124-2008 | ≥20 |
| Thermal conductivity | W/m.k, 25℃ | GB/T10297-1998 | 0.36 |
| Water absorption | 24h, 25C | —- | 0.18% |
| Coefficient of linear expansion | ppm | GB/T 20673-2006 | 45, <Tg
100, >Tg |
| Volume Resistance | Ω· cm, DC500V | GB/T 1692-92 | 1.0×1014 |
Automotive electronic module cover plate bonding, sensor bonding, chip flip bonding, motor magnetic steel magnetic tile bonding, inductor coil fixing
- Curing process of test data: 120℃/1h.
Use process
- If the epoxy glue is stored in a frozen environment, it should be removed to a normal temperature environment before use. During the sizing process, avoid exposing the glue to high temperatures to reduce the consistency of the glue, unless this has been previously tested and proved to be feasible.
- Apply the glue directly to the surface of the object to be bonded after oil removal, rust removal and roughening treatment, select appropriate tools to assist the glue application, and fix it with a fixture. Then cure according to the recommended heating conditions.
- Defrosting time from frozen environment to room temperature environment Depending on the packaging form, 30cc packaging needs to be defrosted for at least 1 hour, 300ml packaging needs to be defrosted for at least 2 hours before use.
- Recommended curing process: 130℃ for 1 hour; Or 120℃ for 1 hour +150℃ for 1 hour, better temperature resistance can be obtained.
- Avoid curing the colloid at an environment below 120 ° C, if the longer time can cure but obtain unexpected or objective product characteristics, affecting the final evaluation results.
Related products
MDEP 3211 High strength Epoxy structure adhesive
Color: Black/Grey
MDEP 3090 Black/Clear Epoxy structure adhesive
Color: Black/Clear