MDEP 3903 high temperature resistance epoxy potting compound
- High Tg, can be used for a long time at 260 ° C
- Excellent adhesion and cracking resistance
- Good toughness, high hardness
- Excellent electrical insulation and stability
- Very low coefficient of linear expansion
- Good water and moisture resistance, very low water absorption
MDEP 3903A/B is a two-component solvent-free heating and curing epoxy potting material, which has a long gel time at normal temperature, specially developed for the special requirements of long-term high temperature resistance 260°C, and can be applied to the packaging protection of sensors, high temperature wiring harness, automotive electronics products with high temperature requirements, and has excellent adhesion and low shrinkage.
| Test items | Test standard | Units | MDEP 3903A | MDEP 3903B |
| Colour | Visual | — | Black paste | Colorless or light yellow clear liquid |
| Viscosity | GB/T 2794-1995 | 25 ° C, mPa·s | 150,000±30,000 | 90±20 |
| Density | GB/T 13354-1992 | 25 ° C, g/cm3 | 1.71±0.05 | 1.15±0.05 |
| Mixing ratio | Mass ratio | Ratio=A:B | 5:1 | |
| Mixing viscosity | GB/T 2794-1995 | 25 ° C, mPa·s | 9,000±3,000 | |
| 40 ° C, mPa·s | 5,200 | |||
| 60 ° C, mPa·s | 2,500 | |||
| Operating time | GB/T 10247-2008 | 25 ° C, hr | 10 | |
| Gel time | GB/T 10247-2008 | 25 ° C, hr | 16 | |
| Curing time | GB/T 10247-2008 | hr | 1hr/120℃+1hr/150℃ | |
| Hardness | GB/T 531-2008 | 25° C, Shore D | 85±5 | |
| 260 ° C, Shore D | 60 | |||
| Coefficient of expansion | GB/T 20673-2006 | μm/ (m, ° C) | <Tg, 28
> Tg, 65 |
|
| Thermal conductivity | GB/T 10297-1998 | W/m.k | 0.65 | |
| Glass transition temperature | DSC | ℃ | 190 | |
| Shear strength | GB/T 7124-2008 | Mpa, Iron/iron | ≥4 | |
| Mpa, aluminum/aluminum | 8 | |||
| Dielectric strength | GB/T 1693-2007 | kV/mm (25 ° C) | ≥20 | |
| Loss factor | GB/T 1693-2007 | (1MHz) (25 ° C) | 0.009 | |
| Dielectric constant | GB/T 1693-2007 | (1MHz) (25 ° C) | 2.9 | |
| Volume Resistance | GB/T 1692-92 | DC500V,Ω· cm | 2.00E +15 | |
Suitable for packaging protection of sensors, high temperature wiring harness, automotive electronics products with high temperature requirements, and has excellent adhesion and low shrinkage.
Operation process
- Glue: A material in the storage process will have settlement, the A component in the original package after stirring evenly, and then A, B components according to the weight ratio
- 5:1 weighing ratio, after mixing evenly can be potting.
- B component in the storage process may appear crystallization or agglomeration (is normal), if the crystallization needs to be placed in the 80℃ oven to melt it before use (the container should be in an open state, so as not to expand the gas, damage the container), and then cold to room temperature after use, this will not affect its performance. l
- If necessary, the potting device can continue to vacuum, which is conducive to increasing the electrical performance of the device.
- Recommended curing conditions :120℃*1h+150℃*1h, can obtain better electrical properties and heat resistance.
- If you need to use glue filling equipment, please consult our Marketing Department.
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