MDPU 8018(2#) Two-component polyurethane gel
- Low viscosity, strong operability
- Excellent low temperature characteristics, excellent weather resistance
- Excellent electrical insulation and stability
- Good waterproof, moisture-proof, water absorption is very low
MDPU 8018 is a two-component solvent-free polyurethane gel at room temperature or heat curing, used for two-component sealing and filling. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating can be cured, can be deeply cured, two components after mixing has a good fluidity, after curing hardness is very low, excellent flexibility, excellent low temperature resistance, used in communication equipment, transformers, control power, ignition controller, electronic sensors and other pouring and filling.
Conventional performance
| Test items | Units and Conditions | Test standard | MDPU 8018(2#) A / B | |
| Appearance | A | Visual | Visual | Clear light yellow fluid |
| B | Visual | Clear light yellow fluid | ||
| Viscosity | A | 25℃ mPa·s | GB/T 2794-2022 | 100 ~ 200 |
| B | GB/T 2794-2022 | 50 ~ 200 | ||
| A+B | GB/T 2794-2022 | 300 ~ 800 | ||
| Density | A | 25℃ g/cm3 | GB/T 13354-1992 | 0.95±0.05 |
| B | GB/T 13354-1992 | 1.00±0.05 | ||
| A+B | GB/T 13354-1992 | 1.00±0.05 | ||
| Operation time | 25℃, minutes, 150g,
Viscosity rises to 100,000cps |
GB/T 2794-2022 | 8 ~ 15 | |
| Gel time | 25℃hrs | GB/T 2794-2022 | 3 ~ 6 | |
| Ratio | Weight ratio | —- | A: B= 100:100 | |
| Curing conditions | ℃/h | —- | 25℃ / 24h or 70℃ /2h | |
Post-cure properties
| Items | Units or conditions | Test standard | 8018 (2#) |
| Colour | Visual | Visual | Yellow transparent |
| Hardness | Shore 00 | GB/T 531.1-2008 | 40±10 |
| Water absorption | 24hrs, 25 ° C, % | GB/T 8810-2005 | < 0.02 |
| Thermal conductivity | W/m.K | GB/T 7124-2008 | 0.10 |
| Glass transition temperature Tg | ℃ | GBT 11998-1989 | – 70 |
| Volume resistivity | 25 ° C, Ω·cm | GB/T 1692-2008 | 2.5 * 1014 |
| Dielectric strength | 25 ° C, kV/mm | GB/T 1695-2005 | > 25 |
| Dielectric constant | 50Hz, 25 ° C | GB/T 1693-2007 | 2.7 |
| Dielectric loss | 50Hz, 25C | GB/T 1693-2007 | 0.002 |
| Linear thermal expansion | μm/ (m, ° C) | GBT 20673-2006 | 230 |
| Application temperature | ℃ | GBT 20028-2005 | -80 ~ 100 |
Used in communication equipment, transformers, control power, ignition controller, electronic sensors and other pouring and filling.
Process of use
- Material taking: Material A of this product contains functional resin. Pay attention to check whether the package is intact before material taking. After material taking is completed, seal the original package in time to prevent excessive contact with moisture. After the adhesive material is exposed to air for a long time, it may lead to bubbling phenomenon after AB material is mixed.
- Operation matters: Material B exposed to the atmosphere will absorb water and hydrolysis occurs, the phenomenon is cloudy until caked, material A also needs to be stored against the tide, so as not to generate too many bubbles during curing. The environment of the curing process needs to control the humidity as low as possible, and the relative humidity should not exceed 60%.
- Preheating: Please bake the poured device at 70~80℃ for 1~2 hours. The temperature can also be reduced to extend the heating time to remove the moisture of the device.
- Defoaming: Vacuum the A\B barrel respectively, and stir at the same time to ensure that the A\B glue is vacuum-free before mixing.
- Pouring: the mixture is poured into the device through the static mixer, and the gel time is about 360mins.
- Curing: 25℃/24 hrs. Ambient humidity should be controlled at <70%, low temperature should extend the curing time as appropriate.
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