MDPU 8110(15#) 1.5W Thermal conductive potting compound

Conventional properties

Post-cure characteristics

Applied to the pouring and posing of communication equipment, transformers, control power supplies, ignition controllers, electronic sensors, etc.

Process of use

• Material extraction: Material A of this product contains functional filling powder, and there will be clear liquid on the upper layer of the glue. Before use, it is necessary to stir the original packaging glue evenly and then remove the material for use. After taking the material, seal the original package in time to prevent excessive contact with water. After the rubber material is exposed to air for a long time, it may lead to bubbling phenomenon after mixing AB material. If possible, the raw material A packaging can be placed in a constant temperature environment of 25℃.
• Operation matters: Material B exposed to the atmosphere will absorb water and hydrolysis occurs, the phenomenon is cloudy until caked, material A also needs to be stored against the tide, so as not to generate too many bubbles during curing. The environment of the curing process should be controlled as low as possible, and the relative humidity should not exceed 60%.
• Preheating: Please bake the poured device at 70~80℃ for 1~2 hours. The temperature can also be reduced and the heating time extended to remove device moisture. 8110(15#) At low temperatures, the viscosity will become high, and the material can be preheated to 30℃ ~50℃, which is easy to use.
• Defoaming: Vacuum the A\B barrel respectively and stir at the same time to ensure that the A\B glue is vacuum-free before mixing.
• Curing: It takes 3 days to fully cure at 25℃. The ambient humidity should be controlled at <70%, and the curing time should be extended when the temperature is low.