MDPU 8110(8030) Transparent Polyurethane Potting Compounds

Excellent low temperature characteristics, excellent weather resistance
Excellent flame retardancy, 94 V-0
Excellent electrical insulation, stability
Good water resistance, moisture resistance, water absorption is very low
Good adhesion to most metals and plastics

Product description

MDPU 8110(8030) is a two-component solvent-free polyurethane material at room temperature or heat curing. It is light yellow and transparent after curing. It is used for two-component sealing, filling, flame retardant and other fields. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating curing can be, can be deep curing, curing less heat, low shrinkage rate; Excellent flexibility after curing, with good flame retardant effect.

Data Sheet

Conventional performance

Test items		Units and Conditions	Test standard	A / B
Appearance	A	Visual	Visual	Clear yellow fluid
	B		Visual	Clear yellow fluid
	A+B		Visual	Light yellow translucent fluid
Viscosity	A	25℃ mPa·s	GB/T 2794-2013	600±300
	B		GB/T 2794-2013	400±200
	A+B		GB/T 2794-2013	500±200
Density	A	25℃ g/cm3	GB/T 13354-1992	0.96±0.05
	B		GB/T 13354-1992	1.10±0.05
	A+B		GB/T 13354-1992	1.03±0.05
Mixing ratio		Weight ratio	—-	A: B= 100:100
Operation time		25℃ min, 100g	GB/T 10247-2008	≥30
Gel time		25℃,min, 100g	GB/T 10247-2008	90-150
Curing conditions		C /h, 100g	GB/T 10247-2008	25℃/24h or 80℃/1h

Post-cure characteristics

Items	Units or conditions	Test standard	MDPU 8110(6030)
Hardness	Shore-A	GB/T 531-2008	35±10
Water absorption	24hrs, 25 ° C, %	GB 8810-2005	< 0.3
Dielectric strength	25 ° C, kV/mm	GB/T 1695-2005	> 16
Flame resistance	UL-94, grade	ANSI/UL-94-1985	V-0
Application temperature	℃	GBT 20028-2005	– 60-120
Thermal conductivity	W/m.K	GB/T10297-1998	0.2
Volume Resistance	25 ° C, Ω·cm	GB/T 1692-92	>1*10¹²
Dielectric constant	50Hz, 25 ° C	GB/T 1693-2007	3.0

Application

This product is often used in electronic capacitors, automotive electronic module potting;
Household appliances such as lampblack stove, microwave oven, rice cooker, washing machine, air conditioning control PCB board filling glue seal;
Life smart toilet, induction toilet, metal induction garbage can circuit board and magnetic coil of moisture and waterproof potting protection.

How to use

Operation process

Pre-drying: dehumidify the items and circuit boards that need to be poked at 50 degrees, and transfer them to the area to be filled with glue after pre-drying.
Mixing: Weigh A and B materials proportionally. Stir vertically with the mixing rod, and stir clockwise (or counterclockwise) in the same direction for 2 to 3 minutes to minimize the mixing of air. Pay attention to the bottom of the container, the edge of the part should also be stirred evenly, otherwise there will be local non-curing phenomenon. During the entire operation process, A, B glue, mixing containers, mixing tools, etc. should avoid contact with water and moisture. The working environment is best adjusted by air conditioning, constant temperature and humidity (temperature 23 ° C, humidity 50%).
Defoaming: For the potting surface requires smooth and no bubbles, the mixture should be vacuumed (≤-0.1mpa) to remove bubbles. Stirring while vacuuming dynamic debubbling, more conducive to the removal of bubbles. If mechanical metering is used for mixed potting, steps 1 and 2 are omitted. (It is recommended to use an automatic mixing device, which not only mixes accurately in the correct ratio, but also does not introduce air to create bubbles.)
Pouring: Pour the mixture into the device. If the device has a complex structure and a large volume, it should be poured in batches. The pouring bubbles can be blown with a hot air gun. Surface bubbles can be eliminated.
Component A and B must be sealed and stored. If it is not used up at one time, cover the bucket again and store it sealed. In particular, for component B, please minimize the contact time with the air during each use.
Mix component A and component B proportionally and evenly in a short period of time, and the mixed glue can only be used within a limited time (operable time), otherwise it will not be used.
The curing time is related to the amount and temperature of each mixing, and the curing time will be relatively shortened when the amount is large or the temperature is high. On the contrary, the curing time will be longer.
The glue before curing is easier to clean, and the glue after curing should be cleaned, soaked, softened and peeled with methylene chloride.
Curing: 25℃/24h or 80℃/1h can be cured. The ambient humidity should be controlled at <50%, and the curing time should be extended when the temperature is low.
Equipment gluing only need to vacuum the AB material in the tank, measure and mix it into the object to be filled sealed, and then solidify or dry through the tunnel furnace.