MDSI 6125 Transparent Silicone potting compound

  • Two components, condensation dealcoholization type
  • Low viscosity, easy to process, strong operability
  • Low hardening shrinkage, no corrosion and no stress
  • Excellent high temperature electrical insulation and stability
  • Excellent adhesion, good water resistance, moisture resistance

 

MDSI 6125 A/B is suitable for potting protection of various components. It can be deeply cured, and the two components have good fluidity after mixing. The operation time can adjust the proportion of curing agent according to the temperature. There is no need to use other primer before use, which has a good bonding effect on most materials, and is suitable for the fixing of accessories and waterproof, dustproof and anti-leakage.

Test items Test Standard 6125T 6125W 6125B
Appearance A Visual Colorless clear fluid White fluid Black fluid
B Colorless

translucent fluid

Colorless translucent fluid Colorless translucent fluid
Viscosity,cps, 25℃ A GB/T 2794-2022 1,000-1,300 5,000±800 1,400-2,000
B 15-50 20-50 20-50
Density,g/cm3, 25℃ A GB/T 13354-1992 1±0.05 1.15-1.25 1.10-1.20
B 1±0.05 0.98-1.02 0.98-1.02
Mixing ratio Mass ratio A : B  =  100: ( 10±3 )
Viscosity after mixing,cps, 25℃ GB/T 2794-2022 850-1,100 2,300 1,200
Operation time after mixing, min GB/T 2794-2022 40-60 40-90 25-50
Tack free time , min GB/T 13477.5-2002 50-100 60-120 50-150
Appearance Visual Transparent White Black
Hardness, SHORE A GB/T 531.1-2008 10-20 20-30 18±4
Tensile strength,MPa GB/T 528-2009 1.0 ≥1.0 0.8
Shear strength,MPa,Steel/Steel GB/T 7124-2008 ≥0.8 ≥0.8 ≥0.8
Loss factor (1 MHz) GB/T 1693-2007 <0.008
Dielectric strength,kV/mm,25 ° C GB/T 1695-2005 ≥20
Volume resistance, DC 500V,Ω·CM GB/T 1692-2008 ≥1.0×1014 ≥1.0×1014 ≥1.0×1014
Dielectric constant (1 MHz) GB/T 1693-2007 <3.00
Long term use temperature range, ℃ GBT 20028-2005 – 50 ∽ 150
  • Power control module
  • Solar module junction box
  • LED spotlights, wall wash lights, strip lights, LED fluorescent lights

Operation and use process

  • The A and B components are weighed according to the ratio of 100:10, mixed evenly, and injected directly into the components (or modules) that need to be potting and protection. It is best to slowly inject along one side of the device wall to reduce the generation of bubbles.
  • The pot-sealed component is left to stand and let its own bubble, and the customer can vacuum debubble the mixed adhesive before potting. It is cured directly at room temperature, and the adhesive layer is usually elastic within 1-6hr.
  • Please consult the Marketing Department of our company for filling and sealing equipment requiring quantitative gluing.

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