MDSI 6130 Black Silicone potting compound

Two component liquid silicone rubber, condensation dealcoholization type
Low viscosity, easy to process, strong operability
Low hardening shrinkage, no corrosion and no stress
Excellent high temperature electrical insulation and stability
Excellent adhesion, good water resistance, moisture resistance

Product description

MDSI 6130 A/B is suitable for potting protection of various components. It can be deeply cured, and the two components have good fluidity after mixing. The operation time can adjust the proportion of curing agent according to the temperature. There is no need to use other primer before use, which has a good bonding effect on most materials, and is suitable for the fixing of accessories and waterproof, dustproof and anti-leakage.

Data Sheet

Test items	Test Standard	6130
Part		A	B
Appearance	Visual	White/gray/black fluid	Colorless to light yellow liquid
Viscosity,cps,25℃	GB/T 2794-2022	4000-7000 cps	20-100 cps
Density,g/cm³,25℃	GB/T 13354-1992	1.35-1.45	0.98-1.01
Mixing ratio	Mass ratio	A: B = 6:1
Viscosity after mixing,cps,25℃	GB/T 2794-2022	2,000-4,000 3,000±500
Operating time after mixing,min	GB/T 2794-2022	10-20 20-40
Tack free time,min	GB/T 13477.5-2002	25-50 60-120
Post-cure characteristic
Appearance	Visual	White/gray/black
Hardness, SHORE A	GB/T 531.1-2008	35-50
Tensile strength,MPa	GB/T 528-2009	>1.5
Elongation at break	GB/T 528-2009	>80%
Shear strength,Al-Al, MPa	GB/T 528-2009	0.6
Coefficient of linear expansion, ppm	GB/T 1036-2008	200
Loss factor (1 MHz)	GB/T 1693-2007	0.01
Dielectric strength,kV/mm,25℃	GB/T 1693-2007	≥20
Volume resistance DC 500V,Ω·cm	GB/T 1693-2007	≥1.0×10¹⁴
Dielectric constant (1 MHz)	GB/T 1693-2007	3.2
Long-term use temperature range, ℃	GBT 20028-2005	– 50 ∽ 150

Application

Automotive electronics, modules
Sensors of all kinds
Power control modules
Solar module junction box
LED spotlights, wall wash lights, strip lights, LED fluorescent lights

How to use

Operation and use technology

The A and B components are weighed according to the ratio of 6:1, mixed evenly, and injected directly into the components (or modules) that need to be potting and protection. It is best to slowly inject along one side of the device wall to reduce the generation of bubbles.
The pot-sealed component is left to stand and let its own bubble, and the customer can vacuum debubble the mixed adhesive before potting. It is cured directly at room temperature, and the adhesive layer is usually elastic within 1hr.
Adding the amount of curing agent B material can speed up the curing speed of the mixture; Reducing the amount of B material can delay the curing speed of the mixture.
Due to the influence of ambient temperature, the curing speed will be slow in winter, and the curing speed will be faster in summer.
Please consult the Marketing Department of our company for filling sealing equipment that needs quantitative filling glue.