MDSI 6340 Thermal conductive silicone thermal potting adhesive

1:1 addition of molded silicone potting glue
Low viscosity and good fluidity
Can be cured at room temperature or by heat
No by-products are produced during curing
Many substrates can be bonded without primer
Wide operating temperature range -60-200 ° C
It has excellent end insulation

Product description

MDSI 340 is a two-component silicone thermal potting adhesive designed for addition reaction tape adhesion and mixing ratio of 100:100, which produces excellent adhesion with a wide range of substances without the need for primer: For example, common polar plastic PC (polycarbonate), PET (polyethylene terephthalate), PA nylon (polyamide), PBT(polybutylene terephthalate), thermosetting epoxy resin, metal aluminum, copper and other materials.

Data Sheet

Test item	Test standard	A	B
Appearance	Visual	Black fluid	Off-white fluid
Density,g/cm3, 25 ° C	GB/T13354-1992	1.6±0.05	1.6±0.05
Viscosity,64#*60rpm,25℃,mPa·s	GB/T 2794-2013	4,200±1,000	3,300± 600
Volume ratio	Mass ratio	A: B = 100:100
Initial mixing viscosity, 64#*60rpm,25℃,mPa·s	GB/T 2794-2013	3,900±600
Operating time, min	/	90±30
Tack free time,min	GB/T 13477.5-2002	< 240
Curing conditions	/	25℃24hr/80℃1hr
Hardness Shore-A	GB/T531.1-2008	70±10
Tensile strength MPa	GB/T528-2009	2.3
Thermal conductivity,W/m.K	GB/T10297-2015	≥0.6
Elongation at break %	GB/T528-1998	60%
Shear strength MPa	GB/T6328-86	AI/AI 1.3 PBT/PBT 1.2
Volume Resistance(DC500V) Ω· cm	GB/T1692-92	2.0×10¹⁴
Dielectric strength, kV/mm	GB/T 1693-2007	22
Dielectric constant, 100kHz	GB/T 1693-2007	3.2
Loss factor, 100kHz	GB/T 1693-2007	0.09
Operating temperature ° C	/	-60 – 200

Application

Sensors, electronic transformers, connectors or terminal blocks, outdoor displays, resistance reactors, inverters, industrial boards, solid state relays, diode packages

How to use

How to use

Mix

Stir well inside the original package. Take the clean plastic container and add the AB component to the mixing container in a predetermined proportion for rapid stirring. Bubbles will be introduced into the colloid during the mixing process. For mass production, it is recommended to use automatic mixing equipment (static mixing is recommended) with automatic gluing.

Defoaming

Such as manual mixing needs defoaming, 340 mixing viscosity is relatively low, can reach the normal surface foaming automatic discharge, such as the structure of the glue product is complex, it is recommended to vacuum for 5 minutes.

Glue filling

Stir evenly mixed liquid, using equipment or manual potting, glue in the potting process, it is best to potting on one side of the device edge, glue liquid can automatically flow to the other side. If the structure is complex, move the position of spitting glue after half of the perfusion to achieve the whole potting.

If a large number of bubbles are included in the colloidal, it will cause honeycomb inside the silica gel and affect the thermal conductivity effect.

Curing

Potting products can be cured at room temperature 24hr, the bonding effect gradually strengthens with the extension of time, and the bonding effect gradually develops with the depth of potting from top to bottom. The potting depth of 3cm is best viewed at 48hr, and the deeper ones need to continue to extend the time for viewing.