MDTIM 5535 3.5w Silicone liquid thermal coductivity Gap Filler

1:1 mixing (thixotropic)
Low stress application
Easy to operate
Heating acceleration reaction
Low hardness and micro-stick
Platinum catalyzed and the siloxane volatiles are extremely low
ROHS, halogen free, REACH certified
UL No.:E538545

Product description

MDTIM 5535 Silicone Gap Filler, thixotropic low stress applications, designed to provide enhanced thermal management for advanced automotive batteries, automotive electronics, and communications equipment. Compared with traditional materials, it provides enhanced reliability and rework ability. Liquid Thermal Conductivity Gap Filler is a highly adaptable material that is easy to use, eliminates assembly tolerances, makes the components on production almost low compression, protects solder joints and Other components. The liquid thermal gel gasket can be perfectly reworked and repaired, significantly reducing the overall cost. The automatically controlled feeding can significantly reduce waste and reduce the overall cost again. It is a two-component fast curing liquid thermal gel gasket. Fully automated assembly is possible, corresponding to the thermal interface materials of Industry 4.0.

Data Sheet

	MDTIM 5535	METHOD	UNIT
Color Part A	White paste	Visual
Color Part B	Pink paste	Visual
Density, A	3.00-3.40	GB/T 13354-1992	g/ml
Density, B	3.00-3.40	GB/T 13354-1992	g/ml
A:B	100 : 100	–	–
Shelf life@ 25℃	6 month	month
After-curing performance
Color	Pink	Visual	–
Working Time	≥45	25℃
Curing condition	5-6hrs/25℃ or 30mins /80℃ or 20mins/100℃
Hardness	30-40	GB/T 531.1-2008	1/10mm, Cone penetration
Tensile strength	0.3	ASTMD412	Mpa
Elongation	70	ASTMD412	%
Coefficient of Thermal Expension	160	ASTM E831	ppm/K
Operating temperature	-60~200		℃
Electrical performance
Breakdown voltage	20	ASTM D149	KV/mm
Volume resistance	1*10¹⁴	ASTM D257	Ohm-cm
Dielectric constant	6	ASTM D150	(1KHz)
Flammability rating	V-0	UL94	1.5mm
Thermal Conductivity	≥3.5	GB/T 10297-2015	W/m*K
Specific heat capacity	1	ASTM E1269	J/g-K
Maximum particle size	90		μm

Application

Lithium battery
vehicle electronics
Communication facility
Computer and peripheral products
Application between heat source and heat sink

How to use

Instructions for use

Mixing:

Mixing part A and part B according to weight or volume ratio 1:1.
The Dual Cartridge package should be mixed with a matching glue gun or automatic gauge to avoid bubble formation.
Manual mixing is not recommended.

Use:

— 50ml or 400ml Dual Cartridge

Install the Dual Cartridge into the applicator and remove the end cap from the front of the Dual Cartridge.
After installing the Dual Cartridge, squeeze the mix from the nozzle until the A and B components are evenly mixed.
The mixed glue is applied to the substrate and mated with the part.
During the working time of the gap filler, clamp the positioning to achieve the treatment strength or gap thickness

–Dispensing equipment