Thermally conductive materials

Thermally conductive materials are critical in managing heat dissipation in electronics and other systems. Each type—Thermally Conductive Adhesive, Gap Filler, Potting Compound, and Grease—serves specific applications based on their unique properties. Here’s an overview:

Thermally Conductive Adhesive

    • Properties: Adhesive with good thermal conductivity and mechanical bonding strength. Often cured to form a solid bond.
    • Applications:
      • Attaching heat sinks to chips, LEDs, or other components without mechanical fasteners.
      • Situations requiring both thermal management and structural bonding.
      • Compact or high-reliability devices where screws or clips aren’t feasible.
    • Advantages:
      • Durable and long-lasting.
      • Offers mechanical support and thermal path.
      • Resistant to environmental factors (moisture, vibration, etc.).
    • Limitations:
      • Permanent bond (hard to rework).
      • Lower thermal conductivity than greases or specialized gap fillers.

Thermally Conductive Gap Filler

  • Properties: Soft, elastomeric materials used to fill uneven gaps between surfaces; available in pad or liquid form.
  • Applications:
    • Bridging gaps between heat-generating components (e.g., CPUs, power modules) and heat sinks or enclosures.
    • Devices with uneven surfaces or large tolerances where conformability is critical.
    • Automotive, telecommunications, and industrial electronics.
  • Advantages:
    • Excellent for applications with varying tolerances or movement.
    • Easy to apply and remove for rework.
    • Good balance of thermal performance and ease of use.
  • Limitations:
    • Lower thermal conductivity than adhesives or greases in some cases.
    • Adds thickness, which could increase thermal resistance.

Thermally Conductive Potting Compound

  • Properties: A liquid material that hardens to encapsulate electronic components, providing thermal conductivity and protection.
  • Applications:
    • Encapsulation of PCBs, transformers, or sensors to protect against environmental hazards (moisture, dust, shock).
    • High-reliability applications like automotive electronics, power supplies, and outdoor systems.
  • Advantages:
    • Excellent for combined thermal management and environmental protection.
    • Reduces vibration and electrical insulation risks.
    • Permanent solution with high durability.
  • Limitations:
    • Permanent, non-reworkable.
    • Can add significant weight and size.
    • Harder to apply and cure compared to other materials.

Thermally Conductive Grease

  • Properties: Paste-like material with high thermal conductivity, but no adhesive or structural properties.
  • Applications:
    • Applied between a processor and a heat sink in computing and power electronics.
    • Any application requiring minimal bond-line thickness and maximum thermal performance.
  • Advantages:
    • High thermal conductivity.
    • Easy to apply and rework.
    • Minimal thermal resistance when applied correctly.
  • Limitations:
    • Requires mechanical fastening for stability.
    • May degrade over time or pump out under temperature cycling.
    • Messy to apply.

How to Choose Thermally Conductive material?

  • Yes: Thermally Conductive Adhesive.
  • No: Consider other materials.
  • Yes: Thermally Conductive Potting Compound.
  • No: Others may suffice.
  • Yes: Thermally Conductive Gap Filler.
  • No: Consider adhesive or grease.
  • Yes: Thermally Conductive Grease or Gap Filler.
  • No: Adhesive or potting may be better.
  • Max performance: Grease.
  • Balanced performance and utility: Gap Filler or Adhesive.
    • Yes: Adhesive or Potting Compound.
    • No: Gap Filler or Grease.