MDPU 8650 High Thermal urethane potting compound

Low viscosity, strong operability
Excellent low temperature characteristics, excellent weather resistance
High Thermal urethane potting compound: 1.2W/m.K
Excellent electrical insulation and stability
Good adhesion to most metals and plastics

Product description

MDPU 8650 A/B is a two-component solvent-free room temperature or heat curing high Thermal urethane potting compound, used for two-component sealing and filling.
Room temperature and heating can be cured, can be deeply cured, two components after mixing has good fluidity, excellent flexibility after curing, high thermal conductivity

Data Sheet

Conventional properties

Test items		Units and Conditions	Test standard	A / B
Appearance	A	Visual	Visual	Black/white viscous fluid
Appearance	B	Visual	Visual	Tan liquid
Viscosity	A	25℃ mPa·s	GB/T 10247-2008	25,000±10,000
	B		GB/T 10247-2008	35±10
	A+B		GB/T 10247-2008	2,500±800
Density	A	25℃ g/cm3	GB/T 15223-1994	1.80±0.05
	B		GB/T 15223-1994	1.23±0.05
	A+B		GB/T 15223-1994	1.75±0.05
Operation time		25℃ min 150g Viscosity to 100000mPa·s	GB/T 10247-2008	60 ~ 120
Gel time		25℃ hrs 150g	GB/T 10247-2008	4 ~ 8
Ratio		Weight ratio	—-	A: B= 100:10
Curing conditions		℃/h	—-	25℃ / 72h or 70℃ /3h

Post-cure characteristics

Items	Units or conditions	Test standard	MDPU 8650
Colour	Visual	Visual	Black or white
Hardness	Shore D	GB/T 531-2008	45±5
Water absorption	24hrs, 25 ° C, %	GB 8810-2005	< 0.2
Tensile strength	MPa	GB/T 528-2009	7.0
Elongation	%	GB/T 528-2009	50
Shear strength	MPa, Fe-Fe	GB/T 6328-86	1.5
Shear strength	MPa, Al-Al	GB/T 6328-86	1.5
Thermal conductivity	W/m.K	GB/T10297-1998	1.20
Glass transition temperature Tg	℃	GBT 11998-1989	10
Volume Resistance	25 ° C, Ω·cm	GB/T 1692-92	1.5 * 1014
Dielectric strength	25 ° C, kV/mm	GB/T 1695-2005	18
Dielectric constant	50Hz, 25 ° C	GB/T 1693-2007	4.50
Dielectric loss	50Hz, 25C	GB/T 1693-2007	0.012
Linear contraction	%	HGT 2625-1994	1.0
Linear thermal expansion	μm/ (m, ° C)	GBT 20673-2006	<Tg, 35 >Tg, 120
Temperature of application	℃	GBT 20028-2005	-50 – 130
Flame retardant rating	UL	UL94	V-0

Application

Used in communication equipment, transformers, control power, ignition controller, electronic sensors and other pouring and pooping.

How to use

Process of use

Material extraction: Material A of this product contains functional filling powder, and there will be clear liquid on the upper layer of glue. Before use, it is necessary to stir the original packaging glue evenly, and then take material for use. After the material is taken out, the original packaging should be sealed in time to prevent excessive contact with water. After the adhesive material is exposed to air for a long time, it may lead to bubbling phenomenon after mixing AB material. If possible, the raw package of A material can be placed in a thermal insulation environment above 30 degrees.
Operation matters: Material B exposed to the atmosphere will absorb water and hydrolysis occurs, the phenomenon is turbidized until caked, material A also needs to be stored away from the tide, so as not to generate too many bubbles during curing. The environment of the curing process needs to control the humidity as low as possible, and the relative humidity should not exceed 60%.
Preheating: Please bake the poured device at 70~80℃ for 1~2 hours. It can also reduce the temperature and extend the heating time to remove the moisture of the device. At low temperature, the viscosity of MDPU 8650 will become higher, and the material can be preheated to 25℃~45℃, which is easy to use.
Defoaming: Vacuum the A\B barrel respectively, and stir at the same time to ensure that the A\B rubber liquid is vacuum-free before mixing.
Pouring: the mixture is poured into the device through the static mixer, and the gel time is about 4~8hrs.
Curing: 25℃/72 hrs, ambient humidity should be controlled at <70%, low temperature should extend the curing time as appropriate