MDEP 3301 flexible epoxy potting gel
- Excellent adhesion and cracking resistance
- Excellent electrical insulation and thermal stability
- Low water absorption, good water and moisture resistance
MDEP 3301 is a two-component solvent-free, room temperature curing epoxy potting adhesive used for two-component sealing, filling and other fields. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. It can be cured at room temperature or by heating, and can be deeply cured, with less heat release and low shrinkage during curing. Excellent flexibility after curing.
| Test item | Test standard | Unit | A | B |
| Colour | Visual | — | Light yellow transparent liquid | Colorless to yellow transparent liquid |
| Viscosity | GB/T 2794-2013 | 25℃, mPa·s | 25,000±3,500 | 100±15 |
| Density | GB/T 13354-1992 | 25℃, g/cm3 | 1.05±0.05 | 1.05±0.05 |
| Mixing ratio | Mass ratio | Ratio=A:B | 100：100 | |
| Mixed viscosity | GB/T 2794-2013 | 25℃,100g,mPa·s | 750±100 | |
| Operating time | GB/T 10247-2008 | 25℃, min | 30-40 | |
| Gel time | GB/T 10247-2008 | 25℃, hr | 1.5hr | |
| Hardness | GB/T 531-2008 | Shore A | 25℃，40±5 | |
| Shear strength | GB/T 7124-2008 | Mpa, iron-iron | ≥1.5 | |
| Loss factor | GB/T 1693-2007 | （1MHz）(25℃) | 0.08 | |
| Dielectric constant | GB/T 1693-2007 | （1MHz）(25℃) | 3.6 | |
| Volume resistance | GB/T 1692-92 | DC500V,Ω· cm | 1.0E +13 | |
| Service temperature | — | ℃ | -50-120 | |
Flexible epoxy potting compounds are particularly valued in applications where components experience thermal expansion, mechanical stress, or require environmental sealing with some degree of pliability to prevent cracking.
Operation technology
- Mixing: The A and B components are weighed according to the weight ratio of 100:100, and can be potting after mixing evenly.
- The amount of glue mixed according to the difference in the operation and use time of the mixing amount is different, for example, the mixing 1kg of glue must be used up within 15mins, and 500g of glue must be used up within 25mins to ensure that the filling of glue produces as few bubbles as possible and better filling performance of the filling device.
- If necessary, the potting device can continue to be vacuumed, which is conducive to increasing the electrical performance of the device.
- Curing conditions: 25℃*24 hours or 80℃*2 hours.
- If you need to use glue filling equipment, please consult our Marketing Department.
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