MDSI 6250 Silicone Optical grade High transparency potting compound

Silicone High transparency potting compound
Excellent heat resistance
Long-term protection against UVA and UVB rays
Non-yellowing
Fast cure and quick release
Extremely accurate molding results
Lighter than glass

Product description

MDSI 6250 High transparency Silicone Optical grade potting compound.

It is mainly designed for manufacturing optical device modules, and can be used for injection molding optical lenses and optical waveguide coupling to reduce scattering loss, resist the influence of environmental pollution, moisture, shock, vibration, etc., and can maintain its optical properties, mechanical properties and electrical properties for a long time under a wide range of temperature, humidity and harsh environmental conditions.

Data Sheet

Typical properties of material

Pre-curing properties
Composition	6250 A	6250 B
Appearance	Colorless clear fluid	Colorless clear fluid
Viscosity, mPa·s(25 ° C)	4000-6000	4000-6000
Specific gravity, g/cm3(25 ° C)	0.99	0.99
Allocation Method	Injection molding

Material manipulation using craft

Temperature	25 ℃	28 ℃
time	100 minutes	70 minutes

Typical curing conditions

24hr@25℃, or 60 mins@80℃. If adhesion is required, the curing condition is 3hrs@100℃.

Typical properties of the material after curing

Curing condition: 60mins@80℃

Hardness,shore A		50
Tensile strength, MPa		5.5
Elongation		100%
Tear strength, N/mm2		3
Refractive index,25 ° C		1.4120
Transmittance,%	450nm@1mm	> 90
Volume resistivity, ohm.cm		2*1015
Dielectric constant,1MHz		3.8
Dielectric loss,1MHz		0.04
Ion content, ppm	Na+	0.2
	K+	0.1
	Cl+	0.9

Application

How to use

Precautions

The substrate surface should be clean and dry. Heat can be applied to remove moisture from the substrate surface; The substrate surface can be cleaned with naphtha, methyl ethyl ketoxime (MEK), or another suitable solvent. Solvents that dissolve or corrode the substrate should not be used, and solvents that have residue should not be used.
Keep accurate weighing into a clean glass container and mix well and evenly. When mixing with high-speed mixing equipment, the heat generated by high-speed mixing is likely to increase the temperature of the glue, thereby shortening the use time.
Remove bubbles under a vacuum of 10mmHg. Generally remove the bubbles before dispensing the packaging material.
In most cases, polysiloxane is suitable for working for a long time at -45 ° C to 200 ° C, and can withstand 350 ° C for a short time. In specific use, it is best to test according to actual requirements.
Before the material is not cured, it can not contact organic matter containing N\P\S, can not contact ionic compounds such As Sn\Pb\Hg\Bi\As, can not contact active compounds containing acetylene \ vinyl, can not contact peroxide, can not contact water vapor and alcohol compounds. When these substances reach a certain concentration, they will hinder the curing of the material, which is manifested in three phenomena: it has been in a flowing state and is not cured at all, and there is a thin layer on the surface of the base material in a fluid or RAS state, and there is a smile of bubbles on the contact surface of the base material. Should be fully tested before use.
When heating and curing, a replaceable hot air oven should be used to prevent the accumulation of trace hydrogen generated during the curing process and the risk of explosion.