MDGEL 6605 Transparent and Blue soft silicone potting gel

1:1 addition molding high elasticity
Excellent flexibility, eliminates mechanical stress
Very low oil permeability after curing, excellent resistance to toxicity
High temperature electrical insulation is excellent, to provide protection against high pressure
Excellent aging resistance and weather resistance
Excellent waterproof, anticorrosive, moisture-proof, chemical medium resistance

Product description

MDGEL 6605A/B is a two-liquid type clear rugged silicon gel gel that cures to form a cushioned elastic soft material. It is designed to insulate circuit boards from moisture and other harmful contaminants and to provide insulation against high voltages. Another use is to provide stress relief to protect circuit u and interconnectors from high temperature and mechanical stress.

Data Sheet

	MDGEL 6605 Transparent		MDGEL 6605 Light blue
	Component A	Component B	Component A	Component B
Appearance	Colorless clear		Colorless clear	Light blue
Viscosity,25℃ CPS	1,000±200	1,000±200	500-700	450-650
Specific gravity, g/cm³	0.99±0.02	0.99±0.02	0.99±0.02	0.99±0.02
Mixing ratio	A: B = 100:100		A: B = 100:100
Viscosity mPa.s after mixing	1100±200, 25℃		500±200, 25℃
Operating time after mixing	15 ± 5 minutes 25℃		7 ± 3 minutes 25℃
Initial curing time	40-60 mins 25℃		≤20 minutes 25℃
Hardening conditions	24 hours at 25℃		24 hours, 25℃
Appearance	Clear gel		Blue clear gel
Hardness Shore 00	35±5		\
Cone penetration 1/10mm	80, awl 1# 150g		260, awl 1# 150g 60, awl 3# 9.38g
Dielectric strength (Kv/mm)	25		25
Volume resistance (Ω·cm) DC500V	1.0 ×10¹⁴		1.0 ×10¹⁴
Loss factor (1 MHz)	0.009		0.009
Dielectric constant (1 MHz)	2.8		2.8
Use temperature range	– 60 ∽ 200℃		– 60 ∽ 200℃

Application

Power modules, such as thyristors,
Solid state relays, diode packages
Cable junction box filling
Waterproof junction box fill
Motor lead box
Electric vehicle control box

How to use

Operation Use craft

The A and B components are weighed at a ratio of 1:1, mixed evenly, and injected directly into the components (or modules) that need to be potting and protected.
The pot-sealed component will stand, the operation time is very fast, and it can be cured in a short time, and the initial curing at normal temperature is about 50-60mins; The operation is suitable for glue filling equipment to implement.