MDPU 8110(8603) Polyurethane potting compound

Low viscosity, long operation time
Excellent mechanical properties, good toughness
Excellent low temperature characteristics, excellent weather resistance
Excellent electrical insulation and stability
Good waterproof, moisture-proof, water absorption is very low
Good adhesion to most metals and plastics

Product description

MDPU 8110(8603) is a two-component solvent-free room temperature or heat curing resin elastomer combination material, used for two-component sealing, filling, flame retardant, heat conduction and other fields. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating can be cured, can be deeply cured, two components after mixing has good fluidity, excellent flexibility after curing, used in communication equipment, transformers, control power, ignition controller, electronic sensors, etc.

Data Sheet

Technical parameters

Test items		Units and Conditions	Test standard	Beige color	Black	White
Appearance	A	Visual	Visual	Beige fluid	Black fluid	White fluid
Appearance	B	Visual	Visual	Transparent to translucent, Colorless to light yellow fluid	Transparent to translucent, Colorless to light yellow fluid	Transparent to translucent, Colorless to light yellow fluid
Viscosity	A	25℃, mPa·s	GB/T 2794-2022	600±300	600±300	600±300
	B		GB/T 2794-2022	1,000±400	1,000±400	1,000±400
	A+B		GB/T 2794-2022	800±400	800±400	800±400
Density	A	25 ° C, g/cm3	GB/T 13354-1992	1.00±0.05	1.00±0.05	1.00±0.05
	B		GB/T 13354-1992	1.15±0.05	1.15±0.05	1.15±0.05
	A+B		GB/T 13354-1992	1.10±0.05	1.10±0.05	1.10±0.05
Operational time		150g, 25℃, min	GB/T 2794-2022	≥40	≥40	≥40
Ratio		Weight ratio	—-	A: B=100:100	A: B=100:100	A: B=100:100
Initial curing conditions		200g, ℃/h	—-	25℃/24hr	25℃/24hr	25℃/24hr

* Note: The operation time can be adjusted according to the ambient temperature, the size of the original and other conditions.

Post-curing characteristics

Items	Units or conditions	Test standard	Beige	Black	White
Hardness	Shore-A	GB/T 531.1-2008	60±10	60±10	60±10
Volume Resistance	25°C, Ω·cm	GB/T 1692-2008	1 * 1015	1 * 1015	1 * 1015
Water absorption	24hrs, 25°C, %	GB 8810-2005	< 0.2	< 0.2	< 0.2
Dielectric strength	25°C, kV/mm	GB/T 1695-2005	22	22	22
Application temperature	℃	GBT 20028-2005	-60 ~ 120	-60 ~ 120	-60 ~ 120
Tensile strength	Mpa	GB/T 528-2009	> 5	> 5	> 5
Elongation at break	%	GB/T 528-2009	> 200	> 200	> 200
Shear strength	Mpa, iron/iron	GB/T 7124-2008	2.2	2.2	2.2
Thermal conductivity	W/m·K	GB/T 10297-2015	0.25	0.25	0.25
Glass transition temperature Tg	℃	GB/T 22567-2008	– 30	– 30	– 30
Dielectric constant	50Hz, 25 ° C	GB/T 1693-2007	2.8	2.8	2.8
Linear contraction	%	HGT 2625-1994	1.2	1.2	1.2
Linear thermal expansion	μm/ (m, ° C)	GBT 20673-2006	200	200	200

Application

Used in communication equipment, transformers, control power, ignition controller, electronic sensors, etc. Pouring and pooping.

How to use

Process of use

Preheating: Please bake the poured device at 70~80℃ for 1~2 hours, which can also reduce the temperature and extend the heating time to remove the moisture of the device. Bepu 6603 at low temperature, the viscosity will become high, can preheat the material to 25℃~45℃ for easy use.
Mixing: Stir well in the original package of A, and then weigh. Weigh A and B materials in proportion, stir vertically with the mixing rod, and stir clockwise (or counterclockwise) in the same direction for 2 to 3 minutes to minimize the mixing of air. Pay attention to the bottom of the container, the edge of the part should also be stirred evenly, otherwise there will be local non-curing phenomenon.
Defoaming: For those who require smooth and no bubbles on the potting surface, the mixture should be vacuumed (≤-0.1mpa) to remove bubbles. Stirring while vacuuming dynamic debubbling, more conducive to the removal of bubbles. If mechanical metering is used for mixed potting, steps 2 and 3 are omitted.
Pouring: Pour the mixture into the device, the device structure is complex, large volume, should be divided pouring. The pouring bubbles can be blown with a hot air gun. Surface bubbles can be eliminated.
Curing: 25℃/24h or 80℃/1h can be cured. The ambient humidity should be controlled at <70%, and the curing time should be extended when the temperature is low.
In the case of insufficient curing time or low room temperature environment, the surface will be sticky the next day is normal, and it will gradually disappear after a few days.
The curing condition of potting glue is affected by temperature and glue amount, high temperature is short curing time, more glue amount is fast curing speed, and vice versa.