MDPU 8110(8608) Two part polyurethane potting compound
- High thermal conductivity, low viscosity and strong maneuverability
- Excellent low temperature characteristics, excellent weather resistance
- Excellent electrical insulation and stability
- Good waterproof, moisture-proof, water absorption is very low
- Good adhesion to most metals and plastics
MDPU 8110(8608) is a two-component solvent-free room temperature or heat curing resin elastomer combination material, used for two-component sealing and filling. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating can be cured, can be deeply cured, two components after mixing has good fluidity, excellent flexibility after curing, used in communication equipment, transformers, control power, ignition controller, electronic sensors, etc. Pouring and pooping.
Conventional properties
Test items | Units and Conditions | Test standard | Black | White | |
Appearance | A | Visual | Visual | Black fluid | White fluid |
B | Visual | Tan liquid | Tan liquid | ||
Viscosity | A | 25 ° C mPa·s, 4#100rpm
1#60rpm 4#200rpm |
GB/T 2794-2022 | 4,000±2,000 | 5,000±2,000 |
B | GB/T 2794-2022 | 35±10 | 35±10 | ||
A+B | GB/T 2794-2022 | 700~1400 | 700~1400 | ||
Density | A | 25℃ g/cm3 | GB/T 13354-1992 | 1.58±0.05 | 1.58±0.05 |
B | GB/T 13354-1992 | 1.23±0.05 | 1.23±0.05 | ||
A+B | GB/T 13354-1992 | 1.58±0.05 | 1.58±0.05 | ||
Operation time | 25℃ min 150g
Viscosity to 100,000mPa·s |
GB/T 2794-2022 | 50~80 | 50~80 | |
Gel time | 25℃ min | GB/T 2794-2022 | 4~6 | 4~6 | |
Initial curing time | 25℃ min | GB/T 2794-2022 | 10~20 | 10~20 | |
Ratio | Weight ratio | —- | A :B=100:16 | A :B=100:16 | |
Curing conditions | ℃/h | —- | 25℃/ 3d or 70℃/2 h | 25℃/3d or 70℃ /2h |
Post-cure characteristic
Items | Units or conditions | Test standard | Black | White |
Hardness | Shore A | GB/T 531.1-2008 | 85±5 | 85±5 |
Water absorption | 24hrs, 25 ° C, % | GB/T 8810-2005 | <0.3 | <0.3 |
Tensile strength | MPa | GB/T 528-2009 | >4.3 | >4.3 |
Elongation | % | GB/T 528-2009 | >20 | >20 |
Shear strength | MPa, Fe-Fe | GB/T 7124-2008 | >2.5 | >2.5 |
Shear strength | MPa, Al-Al | GB/T 7124-2008 | >3.2 | >3.2 |
Thermal conductivity | W/m.K | GB/T 7124-2008 | 0.8±0.05 | 0.8±0.05 |
Vitrification
Transition temperature Tg |
℃ | DSC | -5 | -5 |
Volume resistivity | 25℃,Ω·cm | GB/T 1692-2008 | 5.0*1013 | 5.0*1013 |
Insulation strength | 25℃,kV/mm | GB/T 1695-2005 | >20 | >20 |
Dielectric constant | 50Hz,25℃ | GB/T 1693-2007 | 2.36 | 2.36 |
Dielectric loss | 50Hz,25℃ | GB/T 1693-2007 | 0.02 | 0.02 |
Creepage resistance CTI | V | GB/T 4207-2022 | ≥600 | ≥600 |
Linear contraction | % | GB/T 1036-2008 | 1.0 | 1.0 |
Linear thermal expansion | μm/(m,℃) | GB/T 1036-2008 | <Tg, 55
>Tg, 120 |
<Tg, 55
>Tg, 120 |
Glowing Wire Experiment (GWIT) | ℃ | IEC 60695-2-13:2014 | GWIT:850/3.12 | GWIT:850/3.12 |
Application temperature | ℃ | GB/T 20028-2005 | -50~130 | -50~130 |
* Note: The above performance data is the typical test data of the product at 70% humidity and 25℃ temperature, for customers’ reference only, and cannot be completely guaranteed to achieve all the data in a specific environment. When using, please refer to the actual data.
- Automotive electronics, modules
- LED power drive module
- Solar module junction box
- Electric vehicle charging post module
- Lithium battery pack, capacitor pack
- Magnetic induction coil
- Inverter power supply
Process of use
- Material extraction: Material A of this product contains functional filling powder, and there will be clear liquid on the upper layer of glue. Before use, it is necessary to stir the original packaging glue evenly, and then take material for use. After the material is taken out, the original packaging should be sealed in time to prevent excessive contact with water. After the adhesive material is exposed to air for a long time, it may lead to bubbling phenomenon after mixing AB material. If possible, the raw packaging of A material can be placed in a constant temperature environment of 25℃.
- Operation matters: Material B exposed to the atmosphere will absorb water and hydrolysis occurs, the phenomenon is turbidized until caked, material A also needs to be stored away from the tide, so as not to generate too many bubbles during curing. The environment of the curing process needs to control the humidity as low as possible, and the relative humidity should not exceed 60%.
- Preheating: Please bake the poured device at 70~80℃ for 1~2 hours. It can also reduce the temperature and extend the heating time to remove the moisture of the device. At low temperature, the viscosity of MDPU 8608 will become high, and the material can be preheated to 25 ° C ~45 ° C, which is easy to use.
- Defoaming: Vacuum the A\B barrel respectively, and stir at the same time to ensure that the A\B rubber liquid is vacuum-free before mixing.
- Pouring: the mixture is poured into the device through the static mixer, and the gel time is about 3hrs.
- Curing: It takes 4d to fully cure at 25 ° The ambient humidity should be controlled at <70%, and the curing time should be extended when the temperature is low.
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