MDSI 7102 Series Deoxime type Silicone adhesive
- One part and easy to handle
- Resistance to moisture, dirt and other atmospheric components
- Reduces mechanical stress and tension caused by mechanical, thermal shock and vibration
- Excellent electrical insulation and corona resistance
- Excellent outdoor aging, service life of up to 20-30 years
- Stable mechanical and electrical properties at -60-260 °C
MDSI 7102 deketoxime silicone adhesive is a neutral silicone sealing material that absorbs moisture in the air to cure at room temperature, and cannot be cured at temperature. It has good bonding and sealing performance for most materials and protects electronic products under harsh conditions.
| Test items | Test standard | Units | 7102(1#) | 7102 | 7102 | 7102-1-14 Fluorescence | 7102 Red |
| Code | — | — | 1KSI0190 | 1KSI0200 | 1KSI0180 | 1KSI0710 | 1KSI0570 |
| Appearance | Visual | — | Black flow | Colorless translucent | Black flow | Black flow | Red flow |
| Viscosity | GB/T 2794-2022 | 25℃, cps | 6000-9000 | 5000-9000 | 10000-15000 | 13000-14000 | 15000-25000 |
| Density | GB/T15223-1994 | 25℃, g/cm3 | 1.15±0.05 | 1.01±0.05 | 1.15±0.05 | 1.15±0.05 | 1.35±0.05 |
| Tack-free Time | GB/T13477.5-2002 | 25℃, 55%RH, min | 10-20 | ≤40 | ≤20 | 20-30 | 10-20 |
| Hardness | GB/T 531.1-2008 | Shore A | ≥20 | 15±5 | 25±5 | 25±5 | 35±5 |
| Thermal conductivity | GB/T 10297-2015 | W/m.K | 0.27 | 0.2 | 0.27 | 0.27 | 0.4 |
| Elongation at break | GB/T 528-2009 | % | ≥150 | ≥150 | ≥150 | ≥150 | ≥200 |
| Tensile strength | GB/T 528-2009 | Mpa | ≥0.5 | ≥0.5 | ≥1 | ≥1 | ≥1.5 |
| Shear strength | GB/T 7124-2008 | Mpa, Fe/ Fe | ≥0.50 | ≥0.50 | ≥1 | ≥1 | ≥1 |
| Coefficient of expansion | GB/T 1036-2008 | μm/(m,℃) | 210 | 210 | 210 | 210 | 210 |
| Water absorption | GB/T 8810-2005 | 24h,25℃,% | <0.2 | <0.2 | <0.2 | <0.2 | <0.2 |
| Dielectric strength | GB/T 1695-2005 | kV/mm(25℃) | 18 | 18 | 18 | 18 | 18 |
| Wear and tear factor | GB/T 1693-2007 | (1MHz) (25℃) | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 |
| Dielectric constant | GB/T 1693-2007 | (1MHz) (25℃) | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 |
| Volume resistance | GB/T 1692-2008 | (DC500V) Ω· cm | 1.0*1014 | 1.0*1014 | 1.0*1014 | 1.0*1014 | 1.0*1014 |
- Fields of Application
- Thin layer potting of PCB board and photoelectric device;
- Type C seal
- Small appliance sanitizer cabinet iron
- Industrial high temperature filter
Operation process
- Clean the surface: the surface of the sticky or coated material is cleaned, and the rust, dust and oil are removed with cleaning agent.
- Sizing: Cut the nozzle to the required size and load it into the glue gun. Squeeze the glue solution onto the cleaned surface for an even distribution. When bonding, the adhesive surface can be closed and fixed.
- Curing: the coated part is placed in the air and can be put into use after 24 hours of room temperature curing.
- Note: After opening, use it up as much as possible once, once not used up, when using again, squeeze out the cured part, continue to use, does not affect normal use.
- Please consult MDTECH Marketing Department for the use of dispensing equipment.
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