MDSI 7317 Thermal conductive silicone adhesive

≥0.95 thermal conductivity
The rubber layer is elastic, non-yellowing, non-oil infiltration, excellent overall performance
Resistance to moisture, dirt and other atmospheric components
Reduce mechanical stress and tension caused by mechanical, thermal shock and vibration
Excellent electrical insulation, corona resistance
Excellent outdoor aging, service life of up to 20-30 years
Stable mechanical and electrical properties between -60 and 260 ° C

Product description

MDSI 7317 is a hygroscopic cured neutral dealcoholized silicone, which is made of special thermal conductive materials and forms a flexible rubber body after curing, fully complying with the requirements of the EU ROHS Directive. The release of alcohol substances during the curing process is non-corrosive to polycarbonate (PC), copper and other materials, and has good bonding and sealing performance for most materials, protecting electronic products under harsh conditions in a stable state.

Data Sheet

Test items	Test standard	Unit	7317
Color	Visual	—	White
Viscosity	—	25℃, mPa·s	Paste
Density	GB/T 13354-1992	25℃, g/cm³	2.40±0.05
Tack-free Time	GB/T 13477.5-2002	25℃, 55%RH,min	≤10
Extrusion rate	—	25℃, 55%RH, g/15s	70-110
Hardness	GB/T 531.1-2008	Shore A	60±5
Thermal conductivity	GB/T 10297-2015	W/m.K	≥0.95
Elongation at break	GB/T 528-2009	%	≥100
Tensile strength	GB/T 528-2009	Mpa	≥2
Shear strength	GB/T 7124-2008	Mpa, Steel/steel	≥2.0
Dielectric strength	GB/T 1695-2005	kV/mm（25℃）	20
Loss factor	GB/T 1693-2007	(1MHz) (25℃)	0.09
Dielectric constant	GB/T 1693-2007	(0.5 MHz) (25℃)	3.89
Volume Resistance	GB/T 1692-2008	(DC500V) Ω· cm	≥1.0*1014

Application

LED lighting seal; Automotive electronic components cooling; PCB board and electronic components cooling positioning seal;
High power transistor, thyristor diode and substrate (aluminum, copper) gap filling.

How to use

Operation process

Clean the surface: the surface of the sticky or coated material is cleaned, and the rust, dust and oil are removed with cleaning agent.
Sizing: Cut the nozzle to the required size and load it into the glue gun. Squeeze the glue solution onto the cleaned surface for an even distribution. When bonding, the adhesive surface can be closed and fixed.
Solidification: curing process is a curing process from the surface to the inside, within 24 hours (room temperature and 55% relative humidity) glue will cure 2 ~ 4mm depth, if the glue position is deep, especially not easy to access to the air, the full curing time will be extended, if the temperature is low, curing time will also be extended, It takes more than 3 days for the 6mm thick sealant to fully cure.
Precautions: use as much as possible once after opening, once not used up, when used again, squeeze out the cured part, continue to use, does not affect normal use.
Please consult MDTECH Marketing Department for dispensing equipment.