MDSI 7435 Addition curing thixotropic One component silicone adhesive

One component thixotropic paste, fast heating curing
Clear or chromosomal silicone elastomer adhesive
A wide range of substrates can be bonded without primer, such as stainless steel, glass, ceramics, etc
Excellent flexibility and tear resistance
Addition curing system: no curing byproducts
Certified by ROHS\REACH
It is elastic and stable in the temperature range of -60 ° C to +280 ° C

One component thixotropic paste, fast heating curing
Clear or chromosomal silicone elastomer adhesive
A wide range of substrates can be bonded without primer, such as stainless steel, glass, ceramics, etc
Excellent flexibility and tear resistance
Addition curing system: no curing byproducts
Certified by ROHS\REACH
It is elastic and stable in the temperature range of -60 ° C to +280 ° C

	GB/T		ASTM	Properties	Units	Measured value
				–		7435T	7435W	7435B
				Color status		Transparent	White	Black
				State		Thixotropic paste
10247-2008.			D1084	Thixotropic index		4.5
13354-92.			D792	Specific Gravity	g/cm³	1.05 + / – 0.03
		Physical properties after curing at 120℃ for 30 minutes
				Color		Clear colors	White	Black
531.1-2008.			D2240	Shore Hardness, A		35±5	35±5
528-1998.			D412	Tensile strength	MPa	4	>2.5
528-1998.			D412	Elongation at break	%	500	>350
528-1998.			D412	Tear strength	KN/m	35	22
7759.1-2015.			D389	Compression permanent deformation rate	%	17%	18%
		Adhesion after curing at 120 ° C for 30 minutes
6328-86.				Bond shear strength Al-Al PA – Al	MPa	3.5 2.0	2.5 1.5
10297-1998.				Thermal conductivity	W/mK	0.25	0.25
1692-92.				Volume resistance (DC500V)	Ω· cm	2.0E +15	2.0E +15

Designed to provide long-term thermal stability bonding for various metal, glass, silicone rubber, plastic, mica sheet, ceramic substrates.
Typical applications are: bonding of plastic shell to aluminum sheet, sealing of steam chamber of electric iron, CIPG of motor control box, bonding of heating element.

How to apply

Apply MDSI 7435 to a treated surface and bond to each other. The distribution equipment required depends on the user.

Curing

2g of glue, in order to fully cure, and more importantly to achieve the best bonding effect, the following curing procedure should be used:
25 minutes at 150 ° C, 30 minutes at 135 ° C, or 60 minutes at 120 ° C.
For maximum bonding fastness, it is recommended that the adhesive layer be controlled between 0.1-0.35mm.
For mechanical seal applications of the CIPG process, please cure at 150 degrees Celsius at 30mins.
Larger parts and larger assemblies may take longer to reach the curing temperature.
The curing time can be reduced by direct heating methods such as infrared lamps, heating elements, or direct heating of bonded parts. The curing time depends on the amount of sizing, as well as the area and thickness of the fit. At temperatures below 110 ° C, the curing time can be extended, but the adhesive force cannot be guaranteed.

Compatibility

In some cases, MDSI 7435 bonding some plastics and rubbers may not achieve optimal curing properties. This problem can be better solved if the substrate is pre-treated with a solvent or lightly baked at a higher than curing temperature. Please contact us for pre-treatment agent.
Certain chemicals, hardeners, and plasticizers will inhibit curing, including:
– organotin compounds
– Silicone rubber containing organotin compounds
– Sulfur, polysulfide, polysulfone and other sulfur-containing materials
– Amines, amines, amides, azides