MDSI 7550 Addition curing One component half flow Silicone adhesive

One component thixotropy
Grey silicone adhesive
Quick heat cure
Most substrates, such as metal, glass, ceramics, etc., can be bonded without primer
Addition system, no curing byproducts
Certified by ROHS\REACH
Compliant with Flame retardant UL 94 V-0
It is elastic and stable in the temperature range of -50℃~+280℃

Product description

MDSI 7550 single component thermocurable plus formed silica gel, is platinum-catalyzed addition silica gel, through the black technology to form a single component, and can be stored at room temperature for at least 3 months, by optimizing the liquid powder two-phase combination, to produce high thermal conductivity and high physical strength of elastic curing.

Data Sheet

GB/T	Properties	Units	Value
	Appearance		Gray
GB/T 2794-2022	Viscosity at 23 ° C	mPa·s	75,000±30,000
GB/T 13354-1992	Specific Gravity	g/cm³	2.65±0.05
	Physical properties after curing at 150 ° C for one hour
	colour		Gray
GB/T 531.1-2008	Shore Hardness, A		75±10
GB/T 528-2009	Tensile strength	MPa	4.2
GB/T 528-2009	Elongation at break	%	50
	Adhesion after curing at 150 ° C for one hour
GB/T 7124-2008	Bond shear strength Al/Al	MPa	3.2
GB/T 10297-2015	Thermal conductivity	W/mK	2.2
GB/T 1692-2008	Volume resistivity (DC500V)	Ω· cm	2.3E +14

Application

Designed to provide long lasting thermal stability bonding for various metal, glass, plastic, ceramic substrates.
Bonding of plastic shell and aluminum plate of automotive electronic devices, sealing of steam room and bottom plate of electric iron, bonding and fixing of heating device or mos tube; The bonding of heating elements, and the fixed bonding of wafers.
Bonding applications of MOS tubes.
In the direction of heat conduction application, compared with thermal gasket/gap filler/ RTV silicone/thermal grease, it has a very significant advantage.

How to use

How to apply

Apply MDSI 7550 to a treated surface and glue to each other. The dispensing equipment required depends on the user.
Dispensing process steel mesh printing
Curing
In order to cure completely, and more importantly for the best bonding results, the following curing procedures should be used:
Under the premise of 10g glue accumulation: 25 minutes at 150 ° C, 35 minutes at 135 ° C or 60 minutes at 120 ° C.
Larger parts and larger assemblies may take longer to reach the curing temperature. Curing is achieved by heating up or extending the curing time.
The curing time can be shortened by direct heating methods, such as infrared lamps, heating elements or direct heating of bonded parts. Do not expose MDSI 7550 to temperatures above 200 ° C before it is fully cured, so as not to produce a large number of bubbles in the cured material.