MDSI 7927F One component solvent-resistant dielectric adhesive

one-component solvent-resistant dielectric adhesive
Fluorosilicone resin
Low stress encapsulation material
Protects sensitive electronic components

Product description

MDSI 7927F is a one-component solvent-resistant dielectric adhesive that can be cured into a low stress encapsulation material, and the cured colloid can be guaranteed

Protects sensitive electronic components exposed to harsh environments (fuels, solvents, etc.) for long periods of time.

Data Sheet

Test items	Test criteria	Units	MDSI 7927F
Exterior	Visual	—	Clear, slightly white liquid
Base chemical composition	—	—	Fluorosilicone resin
Viscosity (Brookfield, 52#, 20RPM)	GB/T 2794-2013	25℃, mPa·s	2500-3500
Physical characteristics after curing (160 knots /60min)
Appearance	Visual	—	Clear or slightly white
Needle penetration	—	1/4 mm	85-95
Dielectric constant	—	1MHz	3
Volume resistance	—	ohm*cm	4*10¹²

Application

Protects sensitive electronic components exposed to harsh environments (fuels, solvents, etc.) for long periods of time.

How to use

How to use

Pour into the electronic components that need to be protected for vacuum defoaming treatment;
Heat and cure at 150-160℃ for 1h.
Note: The recommended temperature for vacuum defoaming is 40-60℃.