MDTIM 6230#15 1.5w thermal conductive Silicone potting compound
- Two components plus formed silicone rubber
- 1:1 mixing ratio
- Low hardening shrinkage
- Excellent high temperature electrical insulation and stability
- Good water and moisture resistance
- UL V-0,UL No.E538545
MDTIM 6230(15#) is a kind of two-component silicone thermal poiling adhesive, which has good fluidity after mixing, the operation time can be adjusted according to the temperature, and the room temperature can be deeply cured. It is suitable for the poiling protection of various heat and temperature resistant elements, fully in line with the EU ROHS directive and SVHC REACH requirements.
| Test items | Test Standard | A | B |
| Appearance | Visual | Gray fluid | White fluid |
| Viscosity,cps, 25℃ | GB/T 2794-2022 | 3500-5500 | 3000-5000 |
| Specific gravity,g/cm3, 25℃ | GB/T 13354-1992 | 2.15-2.25 | 2.15-2.25 |
| Mixing ratio | Mass ratio | A：B = 100：100 | |
| Viscosity after mixing,cps, 25℃ | GB/T 2794-2022 | 3500-5500 | |
| Operation time after mixing, min | GB/T 2794-2022 | ≥25 | |
| Tack free time , min | GB/T 13477.5-2002 | ≤130 | |
| Curing conditions | — | 25℃/3.5hr or 70℃/25mins, 80℃/ 20mins | |
| Post-cure characteristic | |||
| Hardened substance form | Visual | Gray elastomer | |
| Hardness, Shore A | GB/T 531.1-2008 | 25±3 | |
| Thermal conductivity, W/mK | GB/T 10297-2015 | ≥1.3 | |
| Elongation, % | GB/T 528-2009 | 65 | |
| Coefficient of linear expansion, K-1, ppm | GB/T 1036-2008 | 130 | |
| Dielectric strength,kV/mm | GB/T 1695-2005 | ≥20 | |
| Volume resistance,DC500V, Ω·CM | GB/T 1692-2008 | 1.1×1014 | |
| Loss factor (1 MHz) | GB/T 1693-2007 | 0.01 | |
| Dielectric constant (1 MHz) | GB/T 1693-2007 | 4.38 | |
| Temperature range,℃ | GBT 20028-2005 | – 60∽200 | |
| Flame resistance | UL-94 | V-0 | |
- Automotive electronics, modules
- LED power drive module
- Solar module junction box
- Electric vehicle charging post module
- Lithium battery pack, capacitor pack
- Magnetic induction coil
Inverter power supply
Operation and use process
- Before sizing, stir A and B components evenly in their respective packages, because the filler may partially settle during storage.
- The A and B components are weighed at a ratio of 1:1, mixed evenly, and injected directly into the components (or modules) that need to be potting and protected. It is best to slowly inject along one side of the wall, which can reduce the generation of bubbles.
- The pot-sealed component is left to stand and let it bubble itself. After the bubbles have basically disappeared, it can be cured at temperature or directly at room temperature, which takes about 3.5hr.
- Please consult the Marketing Department of our company for the potting and sealing equipment that needs quantitative gluing.
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Color: Black/White/Grey
