MDTIM 6230#30 3.0w thermal conductive Silicone potting compound
- Two components plus formed silicone rubber
- 1:1 mixing ratio
- Low hardening shrinkage
- Excellent high temperature electrical insulation and stability
- Good water and moisture resistance
- UL V-0,UL No.E538545
MDTIM 6230(30#)A/B is a kind of two-component silicone thermal conductivity potting adhesive, which has good fluidity after mixing, operation time can be adjusted according to temperature, room temperature can be deeply cured, suitable for potting protection of various heat and temperature resistant components, fully in line with EU ROHS directive and SVHC REACH requirements.
| Test item | Test criteria | Component A | Component B |
| Appearance | Visual | Grey viscous liquid | Cream-white viscous liquid |
| Viscosity,cps, 25℃ | GB/T 2794-2022 | 10000-15000 | 10000-15000 |
| Specific gravity,g/cm3, 25℃ | GB/T 13354-1992 | 2.95-3.05 | 2.95-3.05 |
| Mixing ratio | Mass ratio | A：B = 100：100 | |
| Viscosity after mixing,cps, 25℃ | GB/T 2794-2022 | 10000-15000 | |
| Operation time after mixing, minutes | GB/T 2794-2022 | 50-90 | |
| Initial setting time, hours | — | ≤5 | |
| Hardening conditions | — | 25℃/12hr or 70℃/ 60mins, 80℃/ 30mins | |
| Appearance of hardened matter | Visual inspection | Gray elastomer | |
| Hardness, Shore A | GB/T 531.1-2008 | 10-25 | |
| Thermal conductivity, W/mK | GB/T 10297-2015 | 3.0±0.02 | |
| Coefficient of linear expansion, K-1, ppm | GB/T 1036-2008 | 150 | |
| Dielectric strength,kV/mm | GB/T 1695-2005 | ≥20 | |
| Volume resistance,DC500V, Ω·CM | GB/T 1692-2008 | 1.1×1014 | |
| Loss factor (1 MHz) | GB/T 1693-2007 | 0.01 | |
| Dielectric constant (1 MHz) | GB/T 1693-2007 | 3.80 | |
| Temperature range, ℃ | GBT 20028-2005 | – 60 ∽ 250 | |
- Automotive electronics, modules
- LED power drive module
- Solar module junction box
- Electric vehicle charging post module
- Lithium battery pack, capacitor pack
- Magnetic induction coil
- Inverter power supply
Operation and use process
- Before sizing, stir A and B components evenly in their respective packages, because the filler may partially settle during storage.
- The A and B components are weighed at a ratio of 1:1, mixed evenly, and injected directly into the components (or modules) that need to be potting and protected. It is best to slowly inject along one side of the wall, which can reduce the generation of bubbles.
- The pot-sealed component is left to stand and let it bubble itself. After the bubble has basically disappeared, it can be heated and cured, or it can be cured directly at room temperature, which takes about 12hr.
- Please consult the Marketing Department of our company for the potting equipment that needs quantitative gluing.
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