MDTIM 6230(7#) Low density silicone potting compound
- Two-component addition molding low viscosity
- 1:1 mixing ratio
- Low hardening shrinkage
- Excellent high temperature electrical insulation
- Low density, light weight and non-foaming
- Anti-seismic noise
- Low dielectric constant
- UL V-0,UL No.E538545
MDTIM 6230(7#) is a kind of two-component low-density silicone potting adhesive, which has good fluidity after mixing, the operation time can be adjusted according to temperature, and the room temperature can be deeply cured. It is suitable for potting protection of various heat and temperature resistant elements, and fully meets the requirements of EU ROHS directive and SVHC REACH.
| Test item | Test Standard | Component A | Component B |
| Appearance | Visual | Blue liquid | White liquid |
| Viscosity,cps, 25℃ | GB/T 2794-2022 | 1800-3000 | 1000-2200 |
| Specific gravity,g/cm3, 25℃ | GB/T 13354-1992 | ≤0.7 | ≤0.7 |
| Mixing ratio | Mass ratio | A：B = 100：100 | |
| Operating time after mixing | GB/T 2794-2022 | 60±10 | |
| Curing conditions | — | 25℃/8 hr or 70℃/ 60mins, 80℃/ 30mins | |
| Post-cure characteristics | |||
| Appearance of hardened material | Visual | Blue soft elastomer | |
| Hardness, Shore 00 | GB/T 531.1-2008 | 30-40 | |
| Thermal conductivity, W/mK | GB/T 10297-2015 | 0.15 | |
| Coefficient of linear expansion, K-1, ppm | GB/T 1036-2008 | 230 | |
| Dielectric strength,kV/mm, 25℃ | GB/T 1695-2005 | 20 | |
| Volume resistance,DC 500V, Ω·CM | GB/T 1692-2008 | 1.1×1014 | |
| Loss factor (1 MHz) | GB/T 1693-2007 | 0.01 | |
| Dielectric constant (1 MHz) | GB/T 1693-2007 | 2.30 | |
| Temperature range,℃ | GBT 20028-2005 | – 60 ∽ 200 | |
| Flame retardant type | UL-94 | HB | |
- Fields of Application:
- Automotive electronics module
- Lithium battery pack, capacitor pack
- Rail transit communication box
- Signal transmission device
Operation and use process
- Before sizing, stir A and B components evenly in their respective packages, because the filler may partially settle during storage.
- The A and B components are weighed at a ratio of 1:1, mixed evenly, and injected directly into the components (or modules) that need to be potting and protected. It is best to slowly inject along one side of the wall, which can reduce the generation of bubbles.
- The pot-sealed component is left to stand and let it bubble itself. After the bubble has basically disappeared, it can be heated and cured, or it can be cured directly at room temperature. It takes about 8hr for initial curing.
- Please consult the Marketing Department of our company for the potting and sealing equipment that needs quantitative gluing.
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