EIC System
Magnetic steel bonding
Stator Potting
Cylinder block bonding sealing
The glue point used to drive the motor is mainly magnetic steel magnetic tile bonding, stator potting and cylinder block bonding and sealing.
| Model | Application | Type | Component | Curing conditions | Advantages |
| MDEP 327 | Magnetic steel bonding | Epoxy | 1K | Heating curing | High bonding strength |
| MDEP 321 | Magnetic steel bonding | Epoxy | 1K | Heating curing | Heat curing, high TG |
| MDEP 3209 | Magnetic steel bonding | Epoxy | 2K | Room temperature curing or heating curing | Temperature resistance 180℃ |
| MDEP 3115 | Stator potting | Epoxy | 2K | Room temperature curing or heating curing | Heat curing, high TG，high thermal conductivity |
| MDEP 3112(1#) | Stator potting | Epoxy | 2K | Room temperature curing or heating curing | Two-component medium low viscosity |
| MDEP 3225(32A) | Stator potting | Epoxy | 2K | Heating curing | 1.0W/m.K, high TG |
| MDEP 3225(8#) | Stator potting | Epoxy | 2K | Room temperature curing or heating curing | Good toughness, good adhesion |
| MDSI 587 | Cylinder block bonding seal | Silicone | 1K | Room temperature curing | No adhesive relay, good oil tightness |
| MDSI 7339 | Cylinder block bonding seal | Silicone | 1K | Room temperature curing | Excellent anti-aging performance |
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Lithium electric sealing
Cell structure bonding
Battery bottom and bin body heat conduction
BMS(PCB three defenses)
The battery PACK consists of battery pack, bus bar, soft connection, protection plate, outer packing, output (including connector), highland barley paper, plastic support and other auxiliary materials. PACK assembly technology material strength is particularly critical for battery companies.
| Model | Application | Type | Component | Curing conditions | Advantages |
| MDTIM 6230(7#) | Lithium electric sealing | Silicone | 2K | Room temperature curing or heating curing | Low density, light weight non-foaming |
| MDTIM 6230(15#) | Lithium electric sealing | Silicone | 2K | Room temperature curing or heating curing | Thermal conductivity1.5W/m.K |
| MDFOAM 6230 | Lithium electric sealing | Silicone | 2K | Room temperature curing or heating curing | Low density foamed silicon |
| MDPU 8110(8608) | Lithium electric sealing | PU | 2K | Room temperature curing or heating curing | Excellent flexibility after curing |
| MDPU 8110 | Cell structure bonding | PU | 2K | Room temperature curing or heating curing | Strong adhesion to various substrate |
| MDPU 8650 | Cell structure bonding | PU | 2K | Room temperature curing or heating curing | Thermal conductivity bonding1.2W/m.K |
| MDTIM 5525 | Battery bottom and bin body heat conduction | Silicone | 2K | Room temperature curing or heating curing | Thermal conductivity 2.5 W/mK |
| MDTIM 35# | Battery bottom and bin body heat conduction | Silicone | 1K | Room temperature curing | Thermal conductivity 3.5W/mk |
| MDPU 8650 | Battery bottom and bin body heat conduction | PU | 2K | Room temperature curing or heating curing | Thermal conductivity bonding1.2W/m.K |
| MDCOAT 7007 | BMS(PCB three defenses) | Silicone | 1K | Room temperature curing | One-component 80 shore A |
| MDCOAT 7001 | BMS(PCB three defenses) | Silicone | 1K | Room temperature curing | Low viscosity, good flow |
| MDSI 7333 | BMS(PCB three defenses) | Silicone | 1K | Room temperature curing | Resistance to moisture, dirt |
| MDSI 7002 | BMS(PCB three defenses) | Silicone | 1K | Room temperature curing | No yellowing, no oil seepage |
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Inductance potting
Current sensor
EMC core potting
IGBT/SICmodule
Power device heat conduction
Shell bonding seal
The composition of automobile electronic control system is: sensor, control unit, actuator composition, the core component is the control unit. Electric motor electronic control system as an important part of the new energy automobile industry chain, its technology, manufacturing level directly affects the performance and cost of the vehicle at present, the degree of autonomy in the field of electric control in the country is still far behind the battery by Komaida for many years committed to research and development of imported adhesive flat class products, enhance the market competitiveness of domestic enterprises.
| Model | Application | Type | Component | Curing conditions | Advantages |
| MDTIM 6230(15#) | Inductance potting | Silicone | 2K | Room temperature curing or heating curing | Thermal conductivity 1.5W/mk |
| MDEP 3112(1#) | Inductance potting | Epoxy | 2K | Room temperature curing or heating curing | Two-component medium low viscosity |
| MDSI 6340 | current sensor | Silicone | 2K | Room temperature curing or heating curing | Heat conduction flame retardant |
| MDEP 3112(1#) | current sensor | Epoxy | 2K | Room temperature curing or heating curing | two-component medium low viscosity |
| MDEP 3115 | EMC core potting | Epoxy | 2K | Room temperature curing or heating curing | heat curing, high TG, high thermal conductivity |
| MDGEL 6606 | IGBT/SICmodule | Silicone | 2K | Room temperature curing | Hemperature resistance -50-220℃ |
| MDTIM 5535 | IGBT/SICmodule | Silicone | 1K | / | Thermal conductivity 3.0W/mk |
| MDTIM 35# | Power device heat conduction | Silicone | 1K | / | Thermal conductivity 5.0W/mk |
| MDTIM 60# | Power device heat conduction | Silicone | 1K | / | Thermal conductivity 6.0W/mk |
| MDSI N7339 | shell bonding seal | Silicone | 1K | Room temperature curing or heating curing | FIGP |
| MDSI 6340 | shell bonding seal | Silicone | 2K | Room temperature curing or heating curing | FIGP & CIPG |
| MDSI 7435 | shell bonding seal | Silicone | 1K | Heating curing | FIGP & CIPG |
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Charging gun cavity potting
Charging socket potting
Charging pile Inductive potting
OBD charging module heat conduction potting
The parts of the charging pile mainly include: charging module, AC distribution unit, monitoring unit, lightning protection unit, fuse, relay, external structure including charging gun, high voltage insulation detection board, display screen and so on. The charging module is the core of the charging pile, and the performance of the module directly determines the output capacity of the charging pile. The glue points used in car charging system mainly include charging gun cavity filling seal, charging socket filling seal, charging pile inductance filling seal and OBD charging module thermal conductivity filling seal.
| Model | Application | Type | Component | Curing conditions | Advantages |
| MDPU 8110(8608) | Charging gun cavity potting | PU | 2K | Room temperature curing or heating curing | Excellent flexibility after curing |
| MDPU 8110(8603) | Charging gun cavity potting | PU | 2K | Room temperature curing or heating curing | Low viscosity, long operation time |
| MDEP 3225(8#) | Charging socket potting | Epoxy | 2K | Room temperature curing or heating curing | Good toughness, good adhesion |
| MDTIM 6230(15#) | Inductive potting of charging pile | Silicone | 2K | Room temperature curing or heating curing | Thermal conductivity 1.5W/m.K |
| MDPU 8110(8608) | OBD charging module heat conduction potting | PU | 2K | Room temperature curing or heating curing | Excellent flexibility after curing |
| MDTIM 6230(15#) | OBD charging module heat conduction potting | Silicone | 2K | Room temperature curing or heating curing | thermal conductivity 1.5W/m.K |
| MDEP 3115 | OBD charging module heat conduction potting | Epoxy | 2K | Room temperature curing or heating curing | Heat curing, high TG, high thermal conductivity |
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